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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX150BEWP+
20-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MX7226KN
20-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX1430ETN+D
56-WFQFN Exposed Pad
Samtec Inc.
LTC1747IFW#TRPBF
48-TFSOP (0.240", 6.10mm Width)
IXYS Integrated Circuits Division
MAX1418ETN+D
56-WFQFN Exposed Pad
Samtec Inc.
AD5253BRU1
20-TSSOP (0.173", 4.40mm Width)
Samtec Inc.
AD5253BRU100
20-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
MAX5480ACEE
16-SSOP (0.154", 3.90mm Width)
Samtec Inc.
AD5172BRMZ50
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Samtec Inc.
LTC2630HSC6-LZ8#TRMPBF
6-TSSOP, SC-88, SOT-363
IXYS Integrated Circuits Division
MAX165ACWN+
18-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX543BEWE
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MX7547JN
24-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX544BCPA
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX544BCSA
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
AD9608BCPZRL7-125
64-VFQFN Exposed Pad, CSP
IXYS Integrated Circuits Division
MAX548ACPA
8-DIP (0.300", 7.62mm)
Samtec Inc.
AD7986BCPZ-RL7
20-WFQFN Exposed Pad, CSP
Samtec Inc.
AD5246BKSZ100-R2
6-TSSOP, SC-88, SOT-363
Advanced Linear Devices Inc.
PCM1606EG/2K
IXYS Integrated Circuits Division
MAX1419ETN+D
56-WFQFN Exposed Pad
Micross Components
TC850CLW713
44-LCC (J-Lead)
IXYS Integrated Circuits Division
MAX1427ETN+D
56-WFQFN Exposed Pad
Micross Components
MCP47CVD22T-E/MF
10-VFDFN Exposed Pad
IXYS Integrated Circuits Division
MX7548KN
20-DIP (0.300", 7.62mm)
Samtec Inc.
AD5254BRU100
20-TSSOP (0.173", 4.40mm Width)
Micross Components
MCP47CVD22T-E/UN
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
IXYS Integrated Circuits Division
MAX144AEPA+
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX533ACEE
16-SSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX12527ETK+TD
68-WFQFN Exposed Pad