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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX174AEWI+W
28-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX1402EAI+W
28-SSOP (0.209", 5.30mm Width)
IXYS Integrated Circuits Division
MAX176BC/D
Die
Advanced Linear Devices Inc.
ADS5553IPFPR
80-TQFP Exposed Pad
IXYS Integrated Circuits Division
MAX1338ETN+
56-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX1324ECM+C1W
48-LQFP
IXYS Integrated Circuits Division
MAX11628EEE/V+
16-SSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX11628EEE/V+T
16-SSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX153CPP+CGP
20-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX1438BETK+
68-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX1402EAI+TW
28-SSOP (0.209", 5.30mm Width)
ECSInternational
AK4181A
Samtec Inc.
LTC1290CMJ
20-CDIP (0.300", 7.62mm)
Micross Components
MCP37211-200E/TEVAO
121-TFBGA
Micross Components
MCP37D11T-200E/TE
121-TFBGA
Micross Components
MCP3465R-E/SFX
-
Micross Components
MCP37D21T-200E/TE
121-TFBGA
IXYS Integrated Circuits Division
MX574AJMWI/PR+W
28-SOIC (0.295", 7.50mm Width)
Micross Components
MCP33111D-10T-I/MN
10-WFDFN Exposed Pad
Micross Components
MCP3565R-E/SFX
IXYS Integrated Circuits Division
MAX170DMJA/883B-W
8-CDIP (0.300", 7.62mm)
Samtec Inc.
LTC2315ITS8-12#WTRMPBF
SOT-23-8 Thin, TSOT-23-8
Micross Components
MCP33121D-10T-I/MN
10-WFDFN Exposed Pad
Micross Components
MCP37D11T-80E/TE
Micross Components
MCP3565T-E/QM
Advanced Linear Devices Inc.
ADS1278SKGDA
Die
Micross Components
MCP37231-200E/TE
121-TFBGA
Micross Components
MCP37221T-200E/TE
121-TFBGA
Micross Components
MCP37211T-200E/TE
121-TFBGA
Micross Components
MCP37D21T-80E/TE