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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MX7528SD
20-CDIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MX7534J/D
Die
FinishAdapt Limited
MB3817PFV-G-BNDE1
Advanced Linear Devices Inc.
DAC712U- 1/1K
28-SOIC (0.295", 7.50mm Width)
Samtec Inc.
AD5542AARUZ
Samtec Inc.
AD561JCHIPS
Die
Advanced Linear Devices Inc.
SN0403049DBR
28-SSOP (0.209", 5.30mm Width)
Samtec Inc.
AD5821AD-WAFER
Die
IXYS Integrated Circuits Division
MAX5533EUA
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Samtec Inc.
AD5060BRJZ-2500RL7
Samtec Inc.
AD5824B-WAFER
Samtec Inc.
AD7945BCHIPS
Die
FinishAdapt Limited
MB88346BPF-G-BND-JN-EFE1
ECSInternational
AK4370VN
24-WFQFN Exposed Pad
FinishAdapt Limited
MB88346BPFV-G-BNDE1
Samtec Inc.
AD75060KR-REEL
28-SOIC (0.295", 7.50mm Width)
FinishAdapt Limited
MB88346BPFV-G-BND-EFE1
Samtec Inc.
AD7846KP-REEL
28-LCC (J-Lead)
FinishAdapt Limited
MB88346BPFV-G-EF-SNY-E1
ECSInternational
AK4359AEF
30-LSSOP (0.220", 5.60mm Width)
FinishAdapt Limited
MB88347LPFV-G-BNDE1
ECSInternational
AK4371VN
32-UFQFN Exposed Pad
ECSInternational
AK4385VT
16-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
MB88347LPFV-G-BND-EFE1
FinishAdapt Limited
MB88347PF-G-BND-JNE1
Samtec Inc.
AD9760ARURL
28-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
MB88347PF-G-BND-JN-EFE1
FinishAdapt Limited
MB88347PF-G-BND-JN-ERE1
IXYS Integrated Circuits Division
MAX5331UCB+
64-LQFP
FinishAdapt Limited
MB88347PFV-G-BNDE1