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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Wandboard.Org
74LVC1G66GS/S500H
Transphorm
PI3DPX1205AZLBEX
40-WFQFN Exposed Pad
FinishAdapt Limited
PEB2026TSV1.1
IXYS Integrated Circuits Division
MAX3244ECWI
28-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
CD74HC4316M96
16-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
PBL387821QSD
Omron Electronics Inc-EMC Div
CAT9555WI-T1
24-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
TCA6408ZXYR
20-UFBGA
Samtec Inc.
FIDO5110CBCZ
144-LFBGA, CSPBGA
Advanced Linear Devices Inc.
TS5A3166YZPR
5-XFBGA, DSBGA
Advanced Thermal Solutions Inc.
WP413808
1357-BGA, FCBGA
ON SEMICONDUCTOR
PCA9701HF,118
24-WFQFN Exposed Pad
Samtec Inc.
FIDO5210BBCZ
144-LFBGA, CSPBGA
IXYS Integrated Circuits Division
MAX328MWE/PR3+T
16-SOIC (0.295", 7.50mm Width)
ON SEMICONDUCTOR
PCA9674BS,118
16-VFQFN Exposed Pad
Advanced Thermal Solutions Inc.
GCIXF440AC
352-BGA
Omron Electronics Inc-EMC Div
LB11988-A-E
IXYS Integrated Circuits Division
MAX328MWE/PR3+
16-SOIC (0.295", 7.50mm Width)
VersaSense
MC33121P
14-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX7316AEE+T
16-SSOP (0.154", 3.90mm Width)
Advanced Linear Devices Inc.
TS5A2066DCTR
8-LSSOP, 8-MSOP (0.110", 2.80mm Width)
Advanced Linear Devices Inc.
MAX3232EIPWRQ1
16-TSSOP (0.173", 4.40mm Width)
Transphorm
PI2EQX502EZHEX
16-WFQFN Exposed Pad
ebm-papst Inc.
HC55171IB
28-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX4968CEXB+
64-LFBGA
IXYS Integrated Circuits Division
MAX3245EEWI
28-SOIC (0.295", 7.50mm Width)
ON SEMICONDUCTOR
PCA9701D,118
24-SOIC (0.295", 7.50mm Width)
Samtec Inc.
AD7506SQ
28-CDIP (0.600", 15.24mm)
ON SEMICONDUCTOR
PCA9675BS,118
24-VFQFN Exposed Pad
Wandboard.Org
HEF4052BT-Q100,118
16-SOIC (0.154", 3.90mm Width)