|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Linear Devices Inc. |
SN65HVD35DR
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
ADM242AN
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Abracon |
MX614DW-TR1K
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Wandboard.Org |
74HCT4051DB,118
|
|
16-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
ISL8485EIP
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
Quatech-Division of B&B Electronics |
ISL83239EIV
|
|
28-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2119ME/T&R
|
|
28-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2117MX/T&R
|
|
36-BSOP (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3313ECUB+T
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
EAO |
FT232RNQ-REEL
|
|
32-VFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TIOS1013DMWT
|
|
10-VFDFN Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
TJA1083GTT/0Z
|
|
14-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2117MB/T&R
|
|
36-BSOP (0.295", 7.50mm Width) |
|
|
|
|
Samtec Inc. |
ADM3222ARW
|
|
18-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Micross Components |
MCP2200T-I/SS
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Ellsworth Adhesives |
CX81801-33
|
|
128-QFP |
|
|
|
|
FinishAdapt Limited |
CY7C65632-28LTXCT
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADM3485EAR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
ISL84053IAZ-T
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
CD74HC4053M96S2093
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
SN65HVD01DRCT
|
|
10-VFDFN Exposed Pad |
|
|
|
|
Ellsworth Adhesives |
CX81801-32
|
|
28-VFCLGA |
|
|
|
|
IXYS Integrated Circuits Division |
DS21S07AS/T&R
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
FinishAdapt Limited |
PEB20525EV1.2
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
NLXT301ZPE.F4
|
|
|
|
|
|
|
Quatech-Division of B&B Electronics |
DG441DJZ
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
HC4P5509B-9
|
|
44-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4616CPD+
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4619ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
ADM3202ARN
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
