|
Part Number |
|
|
|
|
Details |
|
|
|
IXYS Integrated Circuits Division |
MAX188DEPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Linear Devices Inc. |
ADC12J1600NKE10
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX154ACWG
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Micross Components |
MCP33141D-05T-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
ADC10D1000CIUT
|
|
292-BBGA |
|
|
|
|
Advanced Linear Devices Inc. |
ADC12D1600RFIUT/NOPB
|
|
292-BBGA |
|
|
|
|
Samtec Inc. |
AD9625BBPZ-2.0
|
|
196-LFBGA Exposed Pad |
|
|
|
|
Samtec Inc. |
AD9209BBPZ-4G
|
|
324-FBGA Exposed Pad |
|
|
|
|
TurboFlex Heaters |
TSM1285BCSA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX154ACNG
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
NetBurner Inc. |
NAU7802SGI TR
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
MCP33141D-05T-E/MS
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX11111ATB+T
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Micross Components |
MCP33141-05T-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Micross Components |
MCP33141-05-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX121CWE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX110ACWE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX150ACWP
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX158ACWI
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Micross Components |
MCP33141D-10T-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Micross Components |
MCP33141-10-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX189CCPA
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
MCP33141D-05-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX195BCPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
MCP33141-05T-E/MS
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX122BCWG
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX135CPI
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX147BCAP
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Micross Components |
MCP33141D-10-E/MN
|
|
10-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX11647EWC+T
|
|
12-WFBGA, WLBGA |
|
|
|
