|
Part Number |
|
|
|
|
Details |
|
|
Advanced Linear Devices Inc. |
JM38510/10103BCA
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3518ETP+TG2Z
|
|
20-WQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX3632ETG+
|
|
24-WFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX3272AETP+T
|
|
20-WFQFN Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
LF147J/883
|
|
14-CDIP (0.300", 7.62mm) |
|
|
|
Advanced Linear Devices Inc. |
LM101AJ/883
|
|
8-CDIP (0.300", 7.62mm) |
|
|
|
IXYS Integrated Circuits Division |
MAX3520ETP+G2Z
|
|
- |
|
|
|
IXYS Integrated Circuits Division |
MAX3520ETP+TG2Z
|
|
- |
|
|
|
Advanced Linear Devices Inc. |
5962R9950402VDA
|
|
|
|
|
|
Embedded Planet |
GN1084-CHIP
|
|
- |
|
|
|
Advanced Linear Devices Inc. |
5962-9460204QHA
|
|
|
|
|
|
Advanced Linear Devices Inc. |
OP27CJGB
|
|
|
|
|
|
Advanced Linear Devices Inc. |
JL198SGA
|
|
|
|
|
|
Advanced Linear Devices Inc. |
77043022A
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3747BEUB+TCBK
|
|
|
|
|
|
Samtec Inc. |
ADN2882A-DF
|
|
Die |
|
|
|
Samtec Inc. |
HMC7590-SX
|
|
Die |
|
|
|
Advanced Linear Devices Inc. |
OPA627NIBU/2K5
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX3747BEUB+CBK
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3969E/D
|
|
Die |
|
|
|
Samtec Inc. |
LTC6430BIUF-20
|
|
24-WFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX951C/D
|
|
Die |
|
|
|
IXYS Integrated Circuits Division |
MAX3272AETP+TG05
|
|
|
|
|
|
Boundary Devices |
M02045-2Y06-T
|
|
16-WQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX954C/D
|
|
Die |
|
|
|
IXYS Integrated Circuits Division |
MAX3765CUB+TG05
|
|
|
|
|
|
Boundary Devices |
M02045-2Y-SPBG
|
|
Die |
|
|
|
Boundary Devices |
M02045-2Y-SPBGF-I
|
|
Die |
|
|
|
onsemi |
WM2002GEFL
|
|
48-WFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX3660ETE+TG0F
|
|
16-WQFN Exposed Pad |
|
|