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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Laird Technologies - Thermal Materials
IS31AP2145E-UTLS2-TR
9-UFBGA
Terasic Inc.
NJM2179D
Terasic Inc.
NJW1109D
Terasic Inc.
NJM2135L
IXYS Integrated Circuits Division
MAX4411EBE+
16-WFBGA, CSPBGA
All Flex Inc.
AS3561
16-UFBGA, WLCSP
EPCOS (TDK)
IS32AP2123-ZLA3
16-TSSOP (0.173", 4.40mm Width) Exposed Pad
onsemi
CS35L37-CWZR
Terasic Inc.
NJM2194D
All Flex Inc.
AS1705V-T-Z
10-WFDFN Exposed Pad
Terasic Inc.
NJW1159D
All Flex Inc.
AS1703V-T-Z
10-WFDFN Exposed Pad
All Flex Inc.
AS3625-ZWLT
IXYS Integrated Circuits Division
MAX98372EWV+
30-WFBGA, WLBGA
Terasic Inc.
NJM2113L
IXYS Integrated Circuits Division
MAX9718EEBL+G45
9-WFBGA, WLBGA
All Flex Inc.
AS1702V-T-Z
10-WFDFN Exposed Pad
ON SEMICONDUCTOR
TDA8932BT/N2,118
32-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
LM4700TF/NOPB
TO-220-11 Isolated Tab, Formed Leads
ON SEMICONDUCTOR
TDA8932BTW/N2,112
32-TSSOP (0.240", 6.10mm Width) Exposed Pad
ON SEMICONDUCTOR
TDA8932BTW/N2,518
32-TSSOP (0.240", 6.10mm Width) Exposed Pad
ON SEMICONDUCTOR
TDA8933T/N1,112
32-SOIC (0.295", 7.50mm Width)
ON SEMICONDUCTOR
TDA8933T/N1,118
32-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
LM48310SDX/NOPB
10-WFDFN Exposed Pad
Advanced Linear Devices Inc.
LM3876T/NOPB
TO-220-11 (Formed Leads)
ON SEMICONDUCTOR
TFA9800J/N1,112
9-SIP Exposed Tab, Formed Leads
ON SEMICONDUCTOR
TFA9810T/N1,112
32-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
LM4864N
8-DIP (0.300", 7.62mm)
ON SEMICONDUCTOR
TDA1308/N2,112
8-DIP (0.300", 7.62mm)
ON SEMICONDUCTOR
TFA9810T/N1,118
32-SOIC (0.295", 7.50mm Width)