|
Part Number |
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|
|
|
Details |
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|
|
Samtec Inc. |
SSM2305RMZ-REEL7
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
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|
Samtec Inc. |
SSM2167-1RMZ-R7
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
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|
|
|
IXYS Integrated Circuits Division |
MAX9814ETD+T
|
|
14-WFDFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX98400AETX+T
|
|
36-WFQFN Exposed Pad |
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|
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|
Brady Corporation |
TS472IQT
|
|
24-VFQFN Exposed Pad |
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|
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|
IXYS Integrated Circuits Division |
MAX9850ETI+T
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Torex Semiconductor Ltd |
BD78326EFJ-ME2
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
|
|
|
|
Samtec Inc. |
SSM2019BRNZRL
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PAM8008DR
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9788ETI+T
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Brady Corporation |
TDA7293V
|
|
Multiwatt-15 (Vertical, Bent and Staggered Leads) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9768BETG+
|
|
24-WFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TAS5805MPWPR
|
|
28-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
FinishAdapt Limited |
IR4302MTRPBF
|
|
44-PowerVFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
DS4420N+
|
|
14-WFDFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TPA3110D2PWPR
|
|
28-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX98400AETX+
|
|
36-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP4991A-GRLS2-TR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9736AETJ+
|
|
32-WQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
IRS2052MTRPBF
|
|
48-VFQFN Exposed Pad |
|
|
|
|
Watterott Electronic GmbH |
TS34119CS RLG
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
SSM2518CPZ-R7
|
|
20-WFQFN Exposed Pad, CSP |
|
|
|
|
Brady Corporation |
TDA7391
|
|
Multiwatt-11 (Vertical, Bent and Staggered Leads) |
|
|
|
|
Samtec Inc. |
SSM2019BRNZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
SSM2305RMZ-REEL
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2005-SLS2-TR
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Brady Corporation |
TDA2822D013TR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP4990D-UTLS2-TR
|
|
9-UFBGA |
|
|
|
|
Transphorm |
PAM8302AADCR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4466EXK+T
|
|
5-TSSOP, SC-70-5, SOT-353 |
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