|
Part Number |
|
|
|
|
Details |
|
|
|
SolidRun LTD |
LM4844TL/NOPB
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9700AEUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718DETB+
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32AP2123-ZLA3-TR
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
SolidRun LTD |
LM4818MX
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718GEBL+TG45
|
|
9-WFBGA, CSPBGA |
|
|
|
|
FinishAdapt Limited |
IR4311MTRPBF
|
|
22-PowerVQFN |
|
|
|
|
ON SEMICONDUCTOR |
TDF8599CTH/N1,118
|
|
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TAS5630BPHDR
|
|
64-TQFP Exposed Pad |
|
|
|
|
SolidRun LTD |
LM4960SQ/NOPB
|
|
|
|
|
|
|
SolidRun LTD |
LM4666SD/NOPB
|
|
14-WFDFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
TPA721DR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
SolidRun LTD |
LM48860TLX/NOPB
|
|
12-WFBGA, DSBGA |
|
|
|
|
SolidRun LTD |
LM4871MX/NOPB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
SolidRun LTD |
LM4916LD/NOPB
|
|
10-WFDFN Exposed Pad |
|
|
|
|
SolidRun LTD |
LM4674ATLX/NOPB
|
|
16-WFBGA, DSBGA |
|
|
|
|
SolidRun LTD |
LM49153TME/NOPB
|
|
25-WFBGA |
|
|
|
|
Samtec Inc. |
SSM2305RMZ-R2
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9709ETN+D
|
|
56-WFQFN Exposed Pad |
|
|
|
|
SolidRun LTD |
LM4917SD/NOPB
|
|
14-WFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
NJU72501MG2-TE1
|
|
16-XFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2112-ZLS2-TR
|
|
28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
IR4312MTRPBF
|
|
44-PowerVFQFN |
|
|
|
|
FinishAdapt Limited |
MA2304DNSXUMA1
|
|
40-VFQFN Exposed Pad |
|
|
|
|
SolidRun LTD |
LM4927SD/NOPB
|
|
8-WFDFN Exposed Pad |
|
|
|
|
Brady Corporation |
TDA2822D
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Terasic Inc. |
NJU8759AGM1T-TE1
|
|
8-SOIC (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
TFA9914UK/N1Z
|
|
48-UFBGA, WLCSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9723DETE+
|
|
16-WQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2110-ZLS2-TR
|
|
28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
