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Memory

Img
Part Number
Manufacturers
Desc
Enquiry
Packing
Details
FinishAdapt Limited
CY7C027-20AXI
100-LQFP
FinishAdapt Limited
CY7C1440AV25-250BZXIT
165-LBGA
FinishAdapt Limited
CY7C1471V33-117AXC
100-LQFP
Micross Components
AT93C56B-SSHM-T
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
CY7C144E-15AXIT
64-LQFP
FinishAdapt Limited
CYD02S36VA-167BBXC
256-LBGA
FinishAdapt Limited
S25FL256SDPNFB003
8-WDFN Exposed Pad
Micross Components
AT34C02D-MAHM-T
8-UFDFN Exposed Pad
Micross Components
93C46BT-I/SN
8-SOIC (0.154", 3.90mm Width)
BI Technologies
CAT24C02YGE-T3
8-TSSOP (0.173", 4.40mm Width)
FinishAdapt Limited
S25FL256SDPBHBC00
24-TBGA
Micross Components
AT24CS04-SSHM-T
8-SOIC (0.154", 3.90mm Width)
Micross Components
AT93C46DY6-YH-E
8-UFDFN Exposed Pad
FinishAdapt Limited
CY7C1462AV33-167AXCT
100-LQFP
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
INT70P1322
FinishAdapt Limited
CY7C1383F-133BZI
165-LBGA
FinishAdapt Limited
CY7C1470V25-167AXCT
100-LQFP
BI Technologies
CAT24C32YGI-T3
8-TSSOP (0.173", 4.40mm Width)
Aim Dynamics
S25FL129P0XMFV003
16-SOIC (0.295", 7.50mm Width)
FinishAdapt Limited
S25FL256SDPBHBC03
24-TBGA
FinishAdapt Limited
CY7C1470V25-200AXCT
100-LQFP
Micross Components
11AA010-I/TO
TO-226-3, TO-92-3 (TO-226AA)
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
P06K9045
FinishAdapt Limited
CY7C1463BV33-133AXI
100-LQFP
KEMET Corporation
AT25DQ321-MH-T
8-UDFN Exposed Pad
FinishAdapt Limited
CY7C1470V33-167AXCT
100-LQFP
Micross Components
93C46B-I/SN
8-SOIC (0.154", 3.90mm Width)
FinishAdapt Limited
S25FL256SAGMFB003
16-SOIC (0.295", 7.50mm Width)
KEMET Corporation
AT25DQ321-S3H-B
8-SOIC (0.209", 5.30mm Width)
FinishAdapt Limited
S25FL256SDPBHB210
24-TBGA