|
Part Number |
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|
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|
Details |
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|
Quatech-Division of B&B Electronics |
ICL3225EIA
|
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20-SSOP (0.209", 5.30mm Width) |
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|
IXYS Integrated Circuits Division |
DG403CJ
|
|
16-DIP (0.300", 7.62mm) |
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Micross Components |
ZL792588GDG2
|
|
- |
|
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Z-World |
BCM68560B1KFSBG
|
|
- |
|
|
|
IXYS Integrated Circuits Division |
DG444DY
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
IXYS Integrated Circuits Division |
MAX22190ATJ+T
|
|
32-WFQFN Exposed Pad |
|
|
|
Micross Components |
LAN7431-I/YXX
|
|
72-VFQFN Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
PCI1221GHK
|
|
|
|
|
|
Omron Electronics Inc-EMC Div |
NC7SB3157L6X
|
|
6-UFDFN |
|
|
|
Brady Corporation |
ST8034HNQR
|
|
24-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX13087ECSA+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Z-World |
BCM63158B1UKFSBG
|
|
|
|
|
|
Samtec Inc. |
LTC1324CS#PBF
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
Alpha & Omega Semiconductor Inc. |
M66592UG#RF0Z
|
|
|
|
|
|
Samtec Inc. |
AD8019ARZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Recom Power |
HI-3002PCIF
|
|
16-VQFN Exposed Pad, CSP |
|
|
|
Omron Electronics Inc-EMC Div |
NLAS4599DTT1G
|
|
SOT-23-6 Thin, TSOT-23-6 |
|
|
|
Brady Corporation |
STPMS2L-PUR
|
|
16-VQFN Exposed Pad |
|
|
|
Omron Electronics Inc-EMC Div |
FSA266L8X
|
|
8-UFQFN |
|
|
|
Omron Electronics Inc-EMC Div |
FSA644BUCX
|
|
36-UFBGA, WLCSP |
|
|
|
Alpha & Omega Semiconductor Inc. |
82P2281PFG8
|
|
80-LQFP |
|
|
|
Transphorm |
PI3HDMI412ADZBEX
|
|
56-VFQFN Exposed Pad |
|
|
|
Micross Components |
ZL50233QCG1
|
|
100-LQFP |
|
|
|
FinishAdapt Limited |
PSB2155HV1.3
|
|
|
|
|
|
Z-World |
BCM63178A2KFEBG
|
|
- |
|
|
|
ON SEMICONDUCTOR |
PCA9560PW,118
|
|
20-TSSOP (0.173", 4.40mm Width) |
|
|
|
IXYS Integrated Circuits Division |
DG401CJ
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
Alpha & Omega Semiconductor Inc. |
EL9112ILZ
|
|
28-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX223CWI+
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
Z-World |
BCM63139SKFSBG
|
|
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