|
Part Number |
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|
|
|
Details |
|
|
|
IXYS Integrated Circuits Division |
MAX319ESA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
MC74LVX4052DR2G
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Z-World |
BCM54616SC0KFBG
|
|
- |
|
|
|
|
Micross Components |
B10011S-MFPG3Y
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
DS30EA101SQ/NOPB
|
|
16-WQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX333AEPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
Omron Electronics Inc-EMC Div |
NLAS4053DR2G
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Z-World |
BCM65235D0IFSBG
|
|
- |
|
|
|
|
Advanced Thermal Solutions Inc. |
FW82801CAM
|
|
421-BBGA |
|
|
|
|
Micross Components |
SY88927VZC-TR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
CD74HC4052PWRG4
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Advanced Thermal Solutions Inc. |
SE82365SL
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
QLX4600LIQT7
|
|
46-WFQFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL36411DRZ-T7
|
|
46-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX334CWE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3222EEAP+T
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
|
MaxLinear, Inc. |
SI85835D-IS
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3250EAI
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Samtec Inc. |
1B22AN
|
|
38-DIP (0.800", 20.32mm), 12 Leads |
|
|
|
|
FinishAdapt Limited |
CY7C65630-56LTXC
|
|
56-VFQFN Exposed Pad |
|
|
|
|
Wandboard.Org |
74HC4851PW,118
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
82P2816ABBG8
|
|
416-BGA |
|
|
|
|
Micross Components |
KS8721BLA4-TR
|
|
48-LQFP |
|
|
|
|
Samtec Inc. |
ADIN2111CCPZ
|
|
48-WFQFN Exposed Pad, CSP |
|
|
|
|
Micross Components |
KS8721BLI-TR
|
|
48-LQFP |
|
|
|
|
Advanced Linear Devices Inc. |
LMH0044SQE/NOPB
|
|
16-WQFN Exposed Pad |
|
|
|
|
Micross Components |
ZL50232GDG2
|
|
208-LBGA |
|
|
|
|
Micross Components |
MIC2550ABTS
|
|
14-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX336CPI
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
Transphorm |
PI7C9X2G608GPBNJEX
|
|
196-LBGA |
|
|
|
