|
Part Number |
|
|
|
|
Details |
|
|
IXYS Integrated Circuits Division |
MAX9927AEE/V+
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
Brady Corporation |
M34116B1
|
|
24-DIP (0.600", 15.24mm) |
|
|
|
ON SEMICONDUCTOR |
MCZ33905CD3EK574
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL3207ECB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX31910AUI+
|
|
28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
Laird - Wireless & Thermal Systems |
TS120P
|
|
8-ESOP (0.250", 6.35mm Width) |
|
|
|
BeagleBoard.org |
26LS32B/BEA
|
|
|
|
|
|
Samtec Inc. |
LT1281ACN#PBF
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
Laird Thermal Systems, Inc. |
EL9110IU
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
Samtec Inc. |
LTC2858IMS-1#PBF
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
Samtec Inc. |
AD8018ARUZ
|
|
14-TSSOP (0.173", 4.40mm Width) |
|
|
|
Advanced Linear Devices Inc. |
PGA400QYZSRQ1
|
|
36-UFBGA, DSBGA |
|
|
|
Laird - Wireless & Thermal Systems |
CYG2218
|
|
18-DIP Module (0.850", 21.59mm), 9 Leads |
|
|
|
Laird - Wireless & Thermal Systems |
CYG2217
|
|
18-DIP Module (0.850", 21.59mm), 9 Leads |
|
|
|
Advanced Linear Devices Inc. |
SP3732BED0PZ
|
|
|
|
|
|
All Flex Inc. |
AS8510-ASSP
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
Pulse Electronics Power |
MLX90323KDF-AAA-000-RE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL3217CBZ
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
Laird - Wireless & Thermal Systems |
TS120
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL232CBET
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
BeagleBoard.org |
26LS33/BFA
|
|
|
|
|
|
ON SEMICONDUCTOR |
PCA9544AD
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL232IBE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
Samtec Inc. |
ADPD144RI-ACEZ-RL
|
|
12-LFLGA |
|
|
|
IXYS Integrated Circuits Division |
MAX3755CCM
|
|
48-TQFP Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
CP82C59AS2065
|
|
|
|
|
|
Laird - Wireless & Thermal Systems |
TS120PL
|
|
8-ESOP (0.250", 6.35mm Width) |
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL232MJE
|
|
16-CDIP (0.300", 7.62mm) |
|
|
|
IXYS Integrated Circuits Division |
MAX3157EPI
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
Laird - Wireless & Thermal Systems |
CYG2020
|
|
18-DIP Module (0.850", 21.59mm), 11 Leads |
|
|