|
Part Number |
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|
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|
Details |
|
|
Micross Components |
USB2422-I/MJ
|
|
24-VFQFN Exposed Pad |
|
|
|
Micross Components |
MCP2140-I/SO
|
|
18-SOIC (0.295", 7.50mm Width) |
|
|
|
IXYS Integrated Circuits Division |
DS2482X-101+T
|
|
9-WFBGA, WLBGA |
|
|
|
Advanced Linear Devices Inc. |
TUSB8043AIRGCT
|
|
64-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
DS2483R+T
|
|
SOT-23-6 |
|
|
|
FinishAdapt Limited |
CY7C68320C-56LFXC
|
|
56-VFQFN Exposed Pad |
|
|
|
Micross Components |
USB7206CT-I/KDX
|
|
100-VFQFN Exposed Pad |
|
|
|
Z-World |
BCM53202MKPBG
|
|
400-BGA |
|
|
|
Advanced Thermal Solutions Inc. |
GD82550ELSL4MK
|
|
196-BGA |
|
|
|
EAO |
VNC2-48L1C-REEL
|
|
48-LQFP |
|
|
|
EAO |
FT230XS-U
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
Micross Components |
USB2514B/M2
|
|
36-VFQFN Exposed Pad |
|
|
|
Micross Components |
MCP2517FDT-H/JHA
|
|
14-VDFN Exposed Pad |
|
|
|
Omron Electronics Inc-EMC Div |
FUSB303BTMX
|
|
12-XFQFN |
|
|
|
Advanced Thermal Solutions Inc. |
GD82550GYSL4Y5
|
|
196-BGA |
|
|
|
IXYS Integrated Circuits Division |
DS2482S-100+T&R
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Micross Components |
MCP2210T-I/MQ
|
|
20-VQFN Exposed Pad |
|
|
|
EAO |
FT232RQ-REEL
|
|
32-VFQFN Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
TUSB8044AIRGCT
|
|
64-VFQFN Exposed Pad |
|
|
|
Advanced Thermal Solutions Inc. |
FLIXF6151BEA2834984
|
|
352-BGA |
|
|
|
ON SEMICONDUCTOR |
PCA9663B,118
|
|
48-LQFP |
|
|
|
Micross Components |
MCP2518FDT-E/QBB
|
|
14-VDFN Exposed Pad |
|
|
|
Micross Components |
USB3300-EZK-TR
|
|
32-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
DS2482S-100+
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Micross Components |
MCP2518FDT-E/SL
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
EAO |
FT231XS-U
|
|
20-SSOP (0.154", 3.90mm Width) |
|
|
|
EAO |
FT231XS-R
|
|
20-SSOP (0.154", 3.90mm Width) |
|
|
|
EAO |
FT230XQ-R
|
|
16-WQFN Exposed Pad |
|
|
|
EAO |
FT230XS-R
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
EAO |
FT260Q-T
|
|
28-WFQFN Exposed Pad |
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|