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Data Acquisition

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX116EAX+
36-BSOP (0.295", 7.50mm Width)
Micross Components
MCP3004T-E/STV02
Micross Components
MCP3202-CI/SNVAO
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LTC2255IUH
32-WFQFN Exposed Pad
Samtec Inc.
AD70-036Z-0RL7
-
Micross Components
MCP3208-BI/SLVAO
16-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LTC2259IUJ-14
40-WFQFN Exposed Pad
Samtec Inc.
AD70-036Z-0RL
-
Micross Components
MCP3208-CI/SLVAO
16-SOIC (0.154", 3.90mm Width)
Samtec Inc.
AD7940BCPZ-RL7
-
Samtec Inc.
AD70-036Z-0
-
IXYS Integrated Circuits Division
MAX12553ETL+TG3U
IXYS Integrated Circuits Division
MAX19192ETI/V+T
Samtec Inc.
AD7380BCPZ
16-WFQFN Exposed Pad, CSP
Samtec Inc.
LTC2255IUH#TR
32-WFQFN Exposed Pad
Samtec Inc.
AD7381BCPZ
16-WFQFN Exposed Pad, CSP
IXYS Integrated Circuits Division
MAX1028BEEP+TG52
IXYS Integrated Circuits Division
MAX174BC/D-C10306
Samtec Inc.
LTC2486IDE#TR
14-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX1030BCEG+TG002
IXYS Integrated Circuits Division
MAX1036EKA+TG002
Samtec Inc.
LTC2227IUH
32-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX1209ETL+TG3U
IXYS Integrated Circuits Division
MAX1037EKA+TG05
Samtec Inc.
LTC2228IUH
32-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX1039AEEE+TGC1
Samtec Inc.
LTC2237IUH
32-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX110BCWE+TG002
Samtec Inc.
LTC2245IUH
32-WFQFN Exposed Pad
Micross Components
MCP3004-I/STVAO
14-TSSOP (0.173", 4.40mm Width)