|
Part Number |
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|
Details |
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Laird - Wireless & Thermal Systems |
CPC7695BCTR
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28-SOIC (0.295", 7.50mm Width) |
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Z-World |
BCM53288MKPBG
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|
- |
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ON SEMICONDUCTOR |
HEF4067BP,652
|
|
24-DIP (0.600", 15.24mm) |
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|
Advanced Linear Devices Inc. |
TUSB217AIRWBR
|
|
12-XFQFN |
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|
Advanced Linear Devices Inc. |
TUSB8042AIRGCT
|
|
64-VFQFN Exposed Pad |
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|
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|
MaxLinear, Inc. |
SI32192-A-GM1
|
|
38-QFN |
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|
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|
MaxLinear, Inc. |
SI32284-A-ZM2R
|
|
48-VFQFN Exposed Pad |
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|
|
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ON SEMICONDUCTOR |
NX3V1T66GM,115
|
|
6-XFDFN |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4602CPE+
|
|
16-DIP (0.300", 7.62mm) |
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|
|
|
IXYS Integrated Circuits Division |
MAX4623CPE+
|
|
16-DIP (0.300", 7.62mm) |
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|
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ON SEMICONDUCTOR |
TEF7006HN/V1,518
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|
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Sumida Corporation |
WIZ750SR-232
|
|
Module |
|
|
|
|
KE Kitagawa |
TD501D485H-E
|
|
10-DIP Module, 8 Leads |
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|
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|
Advanced Linear Devices Inc. |
TRS3386ECPW
|
|
20-TSSOP (0.173", 4.40mm Width) |
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|
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ON SEMICONDUCTOR |
NX3V1T66GM,132
|
|
6-XFDFN |
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Micross Components |
KSZ8873FLL
|
|
64-LQFP |
|
|
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|
Wandboard.Org |
74LVC1G3157GM,132
|
|
6-XFDFN |
|
|
|
|
Advanced Linear Devices Inc. |
SN75C3221EDB
|
|
16-SSOP (0.209", 5.30mm Width) |
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|
|
|
Alpha & Omega Semiconductor Inc. |
HIN202ECBN
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
|
Samtec Inc. |
FIDO5100BBCZ
|
|
144-LFBGA, CSPBGA |
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|
|
|
Advanced Linear Devices Inc. |
MAX207IDW
|
|
24-SOIC (0.295", 7.50mm Width) |
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|
|
|
Transphorm |
ZXFV301N16TA
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
DAC8742HPBSR
|
|
32-TQFP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4590EWE+
|
|
16-SOIC (0.295", 7.50mm Width) |
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|
|
|
MaxLinear, Inc. |
SI32260-C-FM2
|
|
47-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
LAN9117-MT
|
|
100-TQFP |
|
|
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|
IXYS Integrated Circuits Division |
MAX33048EASA+
|
|
|
|
|
|
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ON SEMICONDUCTOR |
NX3L1T3157GM,115
|
|
6-XFDFN |
|
|
|
|
Toko |
TEP0001-01
|
|
Module |
|
|
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|
IXYS Integrated Circuits Division |
MAX4663CAE+
|
|
16-SSOP (0.209", 5.30mm Width) |
|
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