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Interface

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Samtec Inc.
ADG408BCHIPS
Die
Advanced Linear Devices Inc.
TNETD4200GJLA240
Alpha & Omega Semiconductor Inc.
ISL4244EIRZ
32-VFQFN Exposed Pad
Samtec Inc.
ADM239LAN
24-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX337CAI+
28-SSOP (0.209", 5.30mm Width)
IXYS Integrated Circuits Division
MAX308CPE+
16-DIP (0.300", 7.62mm)
Samtec Inc.
LTC2865HDE#TRPBF
12-WFDFN Exposed Pad
Samtec Inc.
ADM241LARS
28-SSOP (0.209", 5.30mm Width)
Advanced Linear Devices Inc.
UC5603N
16-DIP (0.300", 7.62mm)
Advanced Linear Devices Inc.
TMUX6209RUMR
16-WQFN Exposed Pad
EBM-Papst
MT8840AE
-
Samtec Inc.
ADM3202AN
16-DIP (0.300", 7.62mm)
Advantech
QS4A215Q1G
48-FSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX3222ECWN+T
18-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX1485EUB+T
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Quatech-Division of B&B Electronics
ICL3222EIB
18-SOIC (0.295", 7.50mm Width)
Advanced Linear Devices Inc.
TMUX7412FRRPR
16-WQFN Exposed Pad
ON SEMICONDUCTOR
SC16IS740IPW,112
16-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
DS2156L
100-LQFP
IXYS Integrated Circuits Division
MAX303ESE+
16-SOIC (0.154", 3.90mm Width)
Delta Electronics
PEF22554EV3.1
Advanced Thermal Solutions Inc.
N89026
68-LCC (J-Lead)
Micross Components
USB2512B-I/M2
36-VFQFN Exposed Pad
ON SEMICONDUCTOR
NX3L1G3157GW,125
6-TSSOP, SC-88, SOT-363
IXYS Integrated Circuits Division
MAX1487ESA+T
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
ADM238LAN
24-DIP (0.300", 7.62mm)
Advanced Linear Devices Inc.
TUSB8041IRGCR
64-VFQFN Exposed Pad
Advanced Linear Devices Inc.
UC5601N
24-DIP (0.600", 15.24mm)
Delta Electronics
PSB8301VV1.1
Advanced Linear Devices Inc.
TNETD3200GJC