|
Part Number |
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|
Details |
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Wandboard.Org |
74HC4066DB,112
|
|
14-SSOP (0.209", 5.30mm Width) |
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|
Alpha & Omega Semiconductor Inc. |
ISL83488IB
|
|
8-SOIC (0.154", 3.90mm Width) |
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Alpha & Omega Semiconductor Inc. |
HIN211EIA
|
|
28-SSOP (0.209", 5.30mm Width) |
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IXYS Integrated Circuits Division |
MAX308EPE+
|
|
16-DIP (0.300", 7.62mm) |
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Advantech |
ZSC31050FAG1-R
|
|
16-SSOP (0.209", 5.30mm Width) |
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ON SEMICONDUCTOR |
HEF4052BP,652
|
|
16-DIP (0.300", 7.62mm) |
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ON SEMICONDUCTOR |
74HCT4053N,112
|
|
16-DIP (0.300", 7.62mm) |
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Z-World |
BCM53134PKFBG
|
|
- |
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|
|
Alpha & Omega Semiconductor Inc. |
HIN232ACP
|
|
16-DIP (0.300", 7.62mm) |
|
|
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|
MaxLinear, Inc. |
SI32286-A-FMR
|
|
56-VFQFN Exposed Pad |
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ON SEMICONDUCTOR |
NX3L1G384GM,132
|
|
6-XFDFN |
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Sumida Corporation |
WIZ750SR-100
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|
Module |
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Micross Components |
KSZ9131RNXC
|
|
48-VFQFN Exposed Pad |
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MaxLinear, Inc. |
SI32284-A-ZM2R
|
|
48-VFQFN Exposed Pad |
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|
|
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ON SEMICONDUCTOR |
NX3V1T66GM,115
|
|
6-XFDFN |
|
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|
IXYS Integrated Circuits Division |
MAX4602CPE+
|
|
16-DIP (0.300", 7.62mm) |
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|
|
|
IXYS Integrated Circuits Division |
MAX4623CPE+
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Sumida Corporation |
WIZ750SR-232
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|
Module |
|
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|
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ON SEMICONDUCTOR |
TEF7006HN/V1,518
|
|
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|
|
KE Kitagawa |
TD501D485H-E
|
|
10-DIP Module, 8 Leads |
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Micross Components |
KSZ8873FLL
|
|
64-LQFP |
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|
Advanced Linear Devices Inc. |
TRS3386ECPW
|
|
20-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
NX3V1T66GM,132
|
|
6-XFDFN |
|
|
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|
Wandboard.Org |
74LVC1G3157GM,132
|
|
6-XFDFN |
|
|
|
|
Advanced Linear Devices Inc. |
SN75C3221EDB
|
|
16-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HIN202ECBN
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
|
Alpha & Omega Semiconductor Inc. |
ICL3225EIA
|
|
20-SSOP (0.209", 5.30mm Width) |
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|
|
|
Alpha & Omega Semiconductor Inc. |
HIN202EIBN
|
|
16-SOIC (0.154", 3.90mm Width) |
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Laird - Wireless & Thermal Systems |
CPC7695BC
|
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28-SOIC (0.295", 7.50mm Width) |
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|
|
Micross Components |
USB2241I-AEZG-06
|
|
36-VFQFN Exposed Pad |
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