|
Part Number |
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Details |
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|
ON SEMICONDUCTOR |
MPC8247VRTIEA557
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Micross Components |
PIC16LF1509-E/GZ
|
|
20-UFQFN Exposed Pad |
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|
Advanced Thermal Solutions Inc. |
AGFA006R24C3E4X
|
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- |
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|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750GXECB5H82T
|
|
292-BCBGA Exposed Pad |
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|
|
|
FinishAdapt Limited |
MB90497GPFM-G-166-BNDE1
|
|
64-LQFP |
|
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|
|
Panasonic - DTG |
ATUC64L3U-AUT
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|
64-TQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFA006R16A2I3E
|
|
- |
|
|
|
|
Rittal |
MC68360RC33L
|
|
241-BEPGA |
|
|
|
|
Micross Components |
PIC16LF1575-E/JQ
|
|
16-UQFN Exposed Pad |
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|
|
|
FinishAdapt Limited |
SAF-XC864L-1FRI 5V AA
|
|
20-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
TS80C51RD2-VIE
|
|
44-QFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPFM-G-168-BND
|
|
64-LQFP |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F104GJGFB#30
|
|
48-LQFP |
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|
|
|
Micross Components |
PIC16LF1454-E/JQ
|
|
16-UQFN Exposed Pad |
|
|
|
|
BeagleBoard.org |
P87C51RA2FA
|
|
|
|
|
|
|
Micross Components |
TS87C51RC2-VIE
|
|
44-QFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPFM-G-170-BND
|
|
64-LQFP |
|
|
|
|
Micross Components |
PIC16LF1559-E/P
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
Rittal |
MC8640DVU1000HE
|
|
1023-BCBGA, FCCBGA |
|
|
|
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FinishAdapt Limited |
SAA-XC886CLM-6FFA AC
|
|
48-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX250HH3F55E1VG
|
|
2912-BBGA, FCBGA |
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|
|
|
FinishAdapt Limited |
XC87813FFI5VACFXUMA1
|
|
64-LQFP |
|
|
|
|
Micross Components |
TS87C51RB2-MIE
|
|
44-QFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPFM-G-239E1
|
|
64-LQFP |
|
|
|
|
Micross Components |
PIC16LF1764-E/SL
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
PIC16LF1768-E/SO
|
|
20-SOIC (0.295", 7.50mm Width) |
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|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100PFGFA#30
|
|
100-LQFP |
|
|
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Advanced Linear Devices Inc. |
TMS320F28033P1PAGS
|
|
64-TQFP |
|
|
|
|
Micross Components |
TS87C51RD2-LIE
|
|
44-QFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX110HN1F43I2LG
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|
1760-BBGA, FCBGA |
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|
