|
Part Number |
|
|
|
|
Details |
|
|
Advanced Thermal Solutions Inc. |
AGFA012R24C3I3V
|
|
- |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100LKAFB#30
|
|
64-LQFP |
|
|
|
Advanced Thermal Solutions Inc. |
1SX280HU3F50E2VG
|
|
2397-BBGA, FCBGA |
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750GLECR2H33T
|
|
292-BCBGA Exposed Pad |
|
|
|
Micross Components |
PIC16LF1516T-I/ML
|
|
28-VQFN Exposed Pad |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F100LLDFB#30
|
|
64-LQFP |
|
|
|
Rittal |
P2041NSN7MMC
|
|
780-BBGA, FCBGA |
|
|
|
Advanced Thermal Solutions Inc. |
1SX250HU3F50I3VG
|
|
2397-BBGA, FCBGA |
|
|
|
Advanced Thermal Solutions Inc. |
AGFB006R16A2E4X
|
|
- |
|
|
|
ON SEMICONDUCTOR |
MPC8280VVUPEA
|
|
480-LBGA Exposed Pad |
|
|
|
Rittal |
XPC8240RVV250E
|
|
352-LBGA |
|
|
|
Alpha & Omega Semiconductor Inc. |
HD64F3062RF20
|
|
|
|
|
|
Rittal |
MC56F8027VLD
|
|
64-LQFP |
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-191E1
|
|
64-LQFP |
|
|
|
FinishAdapt Limited |
XE164KN16F80LAAFXUMA1
|
|
100-LQFP Exposed Pad |
|
|
|
Micross Components |
TS87C58X2-VIE
|
|
44-QFP |
|
|
|
Advanced Thermal Solutions Inc. |
AGFB014R24B3I3E
|
|
- |
|
|
|
Advanced Thermal Solutions Inc. |
AGFA012R24B2E3E
|
|
- |
|
|
|
Advanced Linear Devices Inc. |
TMS320F28032PNS
|
|
80-LQFP |
|
|
|
Brady Corporation |
SPC560P40L1BEABR
|
|
64-LQFP |
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-216E1
|
|
64-LQFP |
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-218E1
|
|
64-LQFP |
|
|
|
Advanced Thermal Solutions Inc. |
1SX280LH3F55I2VG
|
|
2912-BBGA, FCBGA |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F101MKAFB#30
|
|
80-LQFP |
|
|
|
Brady Corporation |
SPC560P44L5CEFAY
|
|
144-LQFP |
|
|
|
Micross Components |
TS80C32X2-MCE
|
|
44-QFP |
|
|
|
Alpha & Omega Semiconductor Inc. |
HD64F3062BF25Q
|
|
|
|
|
|
VersaLogic Corporation |
S908GR8E0CDWE
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
FinishAdapt Limited |
MB90497GPMC3-GS-233E1
|
|
64-LQFP |
|
|
|
Alpha & Omega Semiconductor Inc. |
R5F101PKAFB#30
|
|
100-LQFP |
|
|