|
Part Number |
|
|
|
|
Details |
|
|
|
IXYS Integrated Circuits Division |
MAX32552-LCJ+
|
|
121-LFBGA |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-163-BNDE1
|
|
64-LQFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX280LN3F43E1VG
|
|
1760-BBGA, FCBGA |
|
|
|
|
Brady Corporation |
STM32F205ZGT6J
|
|
144-LQFP |
|
|
|
|
Micross Components |
TS87C54X2-VCB
|
|
44-LCC (J-Lead) |
|
|
|
|
Brady Corporation |
STM8AF6226TAY
|
|
32-LQFP |
|
|
|
|
Brady Corporation |
UPSD3422EV-40U6
|
|
80-LQFP |
|
|
|
|
Brady Corporation |
STM32F207IGH6J
|
|
201-UFBGA |
|
|
|
|
Rittal |
MPC8314ECVRAFDA
|
|
620-BBGA Exposed Pad |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-185-BNDE1
|
|
64-LQFP |
|
|
|
|
Rittal |
MPC8248VRMIBA
|
|
516-BBGA |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX210HN1F43E2VG
|
|
1760-BBGA, FCBGA |
|
|
|
|
Micross Components |
TS80C31X2-VCC
|
|
44-QFP |
|
|
|
|
Brady Corporation |
SPC56AP60L3CEFAR
|
|
100-LQFP |
|
|
|
|
Rittal |
MPC855TVR80D4
|
|
357-BBGA |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-203E1
|
|
64-LQFP |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
25PPC750L-GB4XXH1T
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX280LU3F50I3VG
|
|
2397-BBGA, FCBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX32510-DPS+
|
|
68-WFQFN Exposed Pad |
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFA008R24C2E3E
|
|
- |
|
|
|
|
Micross Components |
TS87C58X2-VIC
|
|
44-QFP |
|
|
|
|
FinishAdapt Limited |
SAK-XE164HN-24F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
FinishAdapt Limited |
SAK-XE164HN-40F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-153-BNDE1
|
|
64-LQFP |
|
|
|
|
FinishAdapt Limited |
SAK-XE164KN-24F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
ebm-papst Inc. |
CDP1802BCEX
|
|
|
|
|
|
|
FinishAdapt Limited |
SAK-XE164KN-40F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
MC9S08LC36LH557
|
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
AGFB006R24C2I3E
|
|
- |
|
|
|
|
Brady Corporation |
SPC56EC64B3C9EEY
|
|
256-LBGA |
|
|
|
