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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
ebm-papst Inc.
HSP43124SC-33
28-SOIC (0.295", 7.50mm Width)
Quatech-Division of B&B Electronics
HSP43881JC-25
84-LCC (J-Lead)
ebm-papst Inc.
HSP48901GC-20
68-CPGA
IXYS Integrated Circuits Division
MAX261BENG+
24-DIP (0.300", 7.62mm)
Samtec Inc.
LTC1068CG#PBF
28-SSOP (0.209", 5.30mm Width)
Quatech-Division of B&B Electronics
HSP43216JC-52S2485
ebm-papst Inc.
HSP43220JC-15
84-LCC (J-Lead)
Samtec Inc.
LTC1264CSW#PBF
24-SOIC (0.295", 7.50mm Width)
ebm-papst Inc.
HSP43891JC-25
84-LCC (J-Lead)
Samtec Inc.
LTC1569IS8-6#PBF
8-SOIC (0.154", 3.90mm Width)
Quatech-Division of B&B Electronics
HSP48901JC-30
68-LCC (J-Lead)
ebm-papst Inc.
HSP43891GC-25
85-BCPGA
ebm-papst Inc.
HSP43891JC-20
84-LCC (J-Lead)
ebm-papst Inc.
HSP43168VC-33
100-BQFP
Quatech-Division of B&B Electronics
HSP43124SC-45
28-SOIC (0.295", 7.50mm Width)
ebm-papst Inc.
HSP48901GC-30
68-CPGA
ebm-papst Inc.
HSP43168VC-40
100-BQFP
ebm-papst Inc.
HSP43220GM-15/883
84-BCPGA
ebm-papst Inc.
HSP43216JC-52
84-LCC (J-Lead)
ebm-papst Inc.
HSP43881GC-25
85-BCPGA
Samtec Inc.
HMC892ALP5E
32-WFQFN Exposed Pad, CSP
ebm-papst Inc.
HSP43891GC-30
85-BCPGA
ebm-papst Inc.
HSP43168JC-45
84-LCC (J-Lead)
Samtec Inc.
HMC882ALP5E
32-WFQFN Exposed Pad, CSP
ebm-papst Inc.
HSP43168JC-40
84-LCC (J-Lead)
Quatech-Division of B&B Electronics
HSP43168JI-40
84-LCC (J-Lead)
Quatech-Division of B&B Electronics
HSP43216JC-52
84-LCC (J-Lead)
Quatech-Division of B&B Electronics
HSP43220JC-25
84-LCC (J-Lead)
ebm-papst Inc.
HSP43168JC-33
84-LCC (J-Lead)
ebm-papst Inc.
HSP43220JC-25
84-LCC (J-Lead)