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Amplifiers

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX2038CCQ+D
100-TQFP Exposed Pad
Samtec Inc.
OTM5170BCPZN
Laird - Wireless & Thermal Systems
IX9915NTR
8-SOIC (0.154", 3.90mm Width)
Samtec Inc.
LT6108IDCB-2
8-WFDFN Exposed Pad
Samtec Inc.
SMP08FS-REEL
16-SOIC (0.154", 3.90mm Width)
Samtec Inc.
ADN3010-11-50A-S10
Die
IXYS Integrated Circuits Division
MAX24011E/D+GR1
Die
Samtec Inc.
LTC6430AIUF-20
24-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX3969E/D
Die
Samtec Inc.
LTC6430BIUF-20
24-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX951C/D
Die
IXYS Integrated Circuits Division
MAX3272AETP+TG05
Boundary Devices
M02045-2Y06-T
16-WQFN Exposed Pad
IXYS Integrated Circuits Division
MAX954C/D
Die
IXYS Integrated Circuits Division
MAX3765CUB+TG05
Boundary Devices
M02045-2Y-SPBG
Die
Boundary Devices
M02045-2Y-SPBGF-I
Die
onsemi
WM2002GEFL
48-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX3660ETE+TG0F
16-WQFN Exposed Pad
Samtec Inc.
LTC6912CDE-2
12-WFDFN Exposed Pad
IXYS Integrated Circuits Division
MAX951ESA+TG002
IXYS Integrated Circuits Division
MAX4373FEUA+TGC1
IXYS Integrated Circuits Division
MAX4373TEUA+TG05
Samtec Inc.
OTM3228BCPZN-R7
-
Boundary Devices
M02040G-14
16-VFQFN Exposed Pad
Boundary Devices
M02042-4D-SPBG
-
IXYS Integrated Circuits Division
MAX3665E/D-B3D
Die
IXYS Integrated Circuits Division
MAX3265EUE+T
16-TSSOP (0.173", 4.40mm Width) Exposed Pad
IXYS Integrated Circuits Division
MAX3768CUB+T
Boundary Devices
M02043G-14
16-VFQFN Exposed Pad