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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX3086CSD
14-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX3223EEAP
20-SSOP (0.209", 5.30mm Width)
NetBurner Inc.
ISD9341RI
64-LQFP
Wandboard.Org
74HCT4067PW-Q100J
24-TSSOP (0.173", 4.40mm Width)
IXYS Integrated Circuits Division
MAX483ECPA
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX232EEPE
16-DIP (0.300", 7.62mm)
Micross Components
KSZ8851SNL-TR
32-VFQFN Exposed Pad
Micross Components
LAN8831/Q2A
64-VFQFN Exposed Pad
Advanced Linear Devices Inc.
SN65LVDS117DGG
64-TFSOP (0.240", 6.10mm Width)
Quatech-Division of B&B Electronics
ISL1533IVEZ
20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Advanced Linear Devices Inc.
SN65LVCP40RGZR
48-VFQFN Exposed Pad
Advanced Linear Devices Inc.
THS6052IDR
8-SOIC (0.154", 3.90mm Width)
Advanced Linear Devices Inc.
DS100KR401SQ/NOPB
54-WFQFN Exposed Pad
Transphorm
PI3USB4000AZMEX
10-UFQFN
ebm-papst Inc.
IP82C55A-5
40-DIP (0.600", 15.24mm)
IXYS Integrated Circuits Division
MAX7301AAI
28-SSOP (0.209", 5.30mm Width)
Advanced Linear Devices Inc.
DS100KR800SQ/NOPB
54-WFQFN Exposed Pad
ON SEMICONDUCTOR
PTN36242LBS
IXYS Integrated Circuits Division
MAX4605CSE+T
16-SOIC (0.154", 3.90mm Width)
Laird - Wireless & Thermal Systems
TS190P
8-SMD, Gull Wing
Quatech-Division of B&B Electronics
ICL3238ECA
28-SSOP (0.209", 5.30mm Width)
Micross Components
PM7311-BGI
Quatech-Division of B&B Electronics
ISL1557IUEZ-T7
10-VFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
SolidRun LTD
DS8820N
14-DIP (0.300", 7.62mm)
ON SEMICONDUCTOR
PCA9701HF118
24-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX313LCSE+T
16-SOIC (0.154", 3.90mm Width)
Samtec Inc.
AD241AR
28-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX3223EAP
20-SSOP (0.209", 5.30mm Width)
Axiomtek
XR21V1410IL16-F
16-VFQFN Exposed Pad
Brady Corporation
ST7590
48-VFQFN Exposed Pad