|
Part Number |
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|
Details |
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|
IXYS Integrated Circuits Division |
MAX4607EPE+
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16-DIP (0.300", 7.62mm) |
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Micross Components |
KSZ8795CLXCC
|
|
80-LQFP |
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ebm-papst Inc. |
IP82C55AS2064
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IXYS Integrated Circuits Division |
DS2175S
|
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16-SOIC (0.295", 7.50mm Width) |
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Advanced Linear Devices Inc. |
SN75128N
|
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Advanced Linear Devices Inc. |
DS280DF810ABWR
|
|
135-BFBGA, FCBGA |
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|
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Micross Components |
USB2507-ADT
|
|
80-LQFP |
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|
|
Micross Components |
VSC8514XMK-14
|
|
138-VQFN Exposed Pad |
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|
|
Walsin Technology Corporation |
DG441DY-T1-E3
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
SolidRun |
ASNT5020
|
|
24-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX4653ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
IXYS Integrated Circuits Division |
DS2186S
|
|
20-SOIC (0.295", 7.50mm Width) |
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|
|
Samtec Inc. |
ADG842YKSZ-REEL7
|
|
6-TSSOP, SC-88, SOT-363 |
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|
|
Laird - Wireless & Thermal Systems |
CPC5622A
|
|
32-SOIC (0.295", 7.50mm Width) |
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|
onsemi |
CS61881-IQ
|
|
144-LQFP |
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|
|
Micross Components |
KSZ9893RNXI-TR
|
|
64-VFQFN Exposed Pad |
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|
|
SolidRun |
ASNT5121-KHC
|
|
24-CQFN Exposed Pad |
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|
|
Samtec Inc. |
ADG839YKSZ-REEL
|
|
6-TSSOP, SC-88, SOT-363 |
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|
|
Transphorm |
PI2EQX3202BNBEX
|
|
84-LFBGA |
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|
|
IXYS Integrated Circuits Division |
MAX4603CAE+T
|
|
16-SSOP (0.209", 5.30mm Width) |
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|
|
ebm-papst Inc. |
HIN208CA
|
|
24-SSOP (0.209", 5.30mm Width) |
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|
|
IXYS Integrated Circuits Division |
MAX1483CUA
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
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|
ebm-papst Inc. |
ICL232IBEBI
|
|
|
|
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|
Samtec Inc. |
ADG719BRMZ-REEL
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
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|
|
Quatech-Division of B&B Electronics |
ISL5586DIMZ
|
|
28-LCC (J-Lead) |
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|
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Transphorm |
PI90LV180W
|
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14-SOIC (0.154", 3.90mm Width) |
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|
|
Advanced Linear Devices Inc. |
TMUX1104DQAR
|
|
10-UFDFN |
|
|
|
IXYS Integrated Circuits Division |
MAX4621ESE+T
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
|
Micross Components |
LAN8831-V/Q2A
|
|
64-VFQFN Exposed Pad |
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|
|
Samtec Inc. |
LTC2851CS8#PBF
|
|
8-SOIC (0.154", 3.90mm Width) |
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|