|
Part Number |
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|
Details |
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Omron Electronics Inc-EMC Div |
LB1824-E
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Laird - Wireless & Thermal Systems |
CPC5712UTR
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16-SSOP (0.154", 3.90mm Width) |
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Alpha & Omega Semiconductor Inc. |
R8A66150SP#T1
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IXYS Integrated Circuits Division |
DS232AR/T&R
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16-SOIC (0.295", 7.50mm Width) |
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IXYS Integrated Circuits Division |
MAX3221EEAE
|
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16-SSOP (0.209", 5.30mm Width) |
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Alpha & Omega Semiconductor Inc. |
DG411DJZ
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16-DIP (0.300", 7.62mm) |
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Alpha & Omega Semiconductor Inc. |
AMB0482C1RJ
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|
655-FBGA, FCBGA |
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IXYS Integrated Circuits Division |
MAX4950CTO+T
|
|
42-WFQFN Exposed Pad |
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IXYS Integrated Circuits Division |
MAX353ESE+T
|
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16-SOIC (0.154", 3.90mm Width) |
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|
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Alpha & Omega Semiconductor Inc. |
AMB0482C1RJ8
|
|
655-FBGA, FCBGA |
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Samtec Inc. |
ADM3058EBRIZ
|
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8-SOIC (0.295", 7.50mm Width) |
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IXYS Integrated Circuits Division |
DS2181AQ/T&R
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|
44-LCC (J-Lead) |
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Transphorm |
PI2EQX5804CNJE
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|
100-LBGA |
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IXYS Integrated Circuits Division |
MAX1406CWE
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16-SOIC (0.295", 7.50mm Width) |
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ebm-papst Inc. |
IP82C55AS2065
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Transphorm |
PI2EQX5864CZFE
|
|
56-WFQFN Exposed Pad |
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Micross Components |
VSC8489YJU-17
|
|
196-LBGA, FCBGA |
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IXYS Integrated Circuits Division |
MAX3450EETE-G104
|
|
16-WFQFN Exposed Pad |
|
|
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Inphi Corporation |
LV71081E-SPL-MPB-E-SY
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ebm-papst Inc. |
IP82C55AX121
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Walsin Technology Corporation |
DG441DJ-E3
|
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16-DIP (0.300", 7.62mm) |
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Samtec Inc. |
ADGS1212BCPZ-RL7
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|
24-WFQFN Exposed Pad, CSP |
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IXYS Integrated Circuits Division |
MAX3100EEE+
|
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16-SSOP (0.154", 3.90mm Width) |
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Honeywell Sensing and Productivity Solutions |
CP2108-B03-GM
|
|
64-VFQFN Exposed Pad |
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Walsin Technology Corporation |
DG419DJ-E3
|
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8-DIP (0.300", 7.62mm) |
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|
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Samtec Inc. |
ADM3078EYRZ
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
|
Walsin Technology Corporation |
DG202BDY-E3
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
IXYS Integrated Circuits Division |
MAX339EEE+T
|
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16-SSOP (0.154", 3.90mm Width) |
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|
IXYS Integrated Circuits Division |
MAX7312AAG
|
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24-SSOP (0.209", 5.30mm Width) |
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Abracon |
CMX683E4
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16-TSSOP (0.173", 4.40mm Width) |
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