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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Omron Electronics Inc-EMC Div
LB1824-E
Laird - Wireless & Thermal Systems
CPC5712UTR
16-SSOP (0.154", 3.90mm Width)
Alpha & Omega Semiconductor Inc.
R8A66150SP#T1
IXYS Integrated Circuits Division
DS232AR/T&R
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
MAX3221EEAE
16-SSOP (0.209", 5.30mm Width)
Alpha & Omega Semiconductor Inc.
DG411DJZ
16-DIP (0.300", 7.62mm)
Alpha & Omega Semiconductor Inc.
AMB0482C1RJ
655-FBGA, FCBGA
IXYS Integrated Circuits Division
MAX4950CTO+T
42-WFQFN Exposed Pad
IXYS Integrated Circuits Division
MAX353ESE+T
16-SOIC (0.154", 3.90mm Width)
Alpha & Omega Semiconductor Inc.
AMB0482C1RJ8
655-FBGA, FCBGA
Samtec Inc.
ADM3058EBRIZ
8-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
DS2181AQ/T&R
44-LCC (J-Lead)
Transphorm
PI2EQX5804CNJE
100-LBGA
IXYS Integrated Circuits Division
MAX1406CWE
16-SOIC (0.295", 7.50mm Width)
ebm-papst Inc.
IP82C55AS2065
Transphorm
PI2EQX5864CZFE
56-WFQFN Exposed Pad
Micross Components
VSC8489YJU-17
196-LBGA, FCBGA
IXYS Integrated Circuits Division
MAX3450EETE-G104
16-WFQFN Exposed Pad
Inphi Corporation
LV71081E-SPL-MPB-E-SY
ebm-papst Inc.
IP82C55AX121
Walsin Technology Corporation
DG441DJ-E3
16-DIP (0.300", 7.62mm)
Samtec Inc.
ADGS1212BCPZ-RL7
24-WFQFN Exposed Pad, CSP
IXYS Integrated Circuits Division
MAX3100EEE+
16-SSOP (0.154", 3.90mm Width)
Honeywell Sensing and Productivity Solutions
CP2108-B03-GM
64-VFQFN Exposed Pad
Walsin Technology Corporation
DG419DJ-E3
8-DIP (0.300", 7.62mm)
Samtec Inc.
ADM3078EYRZ
8-SOIC (0.154", 3.90mm Width)
Walsin Technology Corporation
DG202BDY-E3
16-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX339EEE+T
16-SSOP (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX7312AAG
24-SSOP (0.209", 5.30mm Width)
Abracon
CMX683E4
16-TSSOP (0.173", 4.40mm Width)