|
Part Number |
|
|
|
|
Details |
|
|
|
Advanced Thermal Solutions Inc. |
RU82566MM
|
|
81-BGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX14950ACTL+
|
|
40-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADG511BRZ-REEL
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
ebm-papst Inc. |
HIN206EIP
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX14950CTO+T
|
|
42-WFQFN Exposed Pad |
|
|
|
|
Quatech-Division of B&B Electronics |
HC55185ECRZ
|
|
32-VQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG418DJ+
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX14982ETO+T
|
|
42-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG445CJ+
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Quatech-Division of B&B Electronics |
CDP1852CE
|
|
24-DIP (0.600", 15.24mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX202ECPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX365CPE+
|
|
|
|
|
|
|
Samtec Inc. |
ADG738BRUZ-REEL7
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
SN74LS612FN
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
TLK2711AJRGQE
|
|
|
|
|
|
|
Samtec Inc. |
ADM3065ETRZ-EP
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI3EQX502IZHE
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADG5401FBCPZ-RL7
|
|
10-WFDFN, CSP |
|
|
|
|
Micross Components |
COM20020I-DZD
|
|
28-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX202EEUE
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX7300AGL
|
|
40-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG418LDJ+
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
LTC2876CDD#PBF
|
|
8-WFDFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
PEB20550H-V1.3
|
|
|
|
|
|
|
MG Chemicals |
GS9009ACKB
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4522EUE+
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
HIN206EIB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
ebm-papst Inc. |
HIN238ACP
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX200EPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4522ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
