|
Part Number |
|
|
|
|
Details |
|
|
|
Omron Electronics Inc-EMC Div |
FIN1047MX
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
ADG509ATQ
|
|
16-CDIP (0.300", 7.62mm) |
|
|
|
|
Transphorm |
PI2EQX8814ANJE
|
|
100-LBGA |
|
|
|
|
Advanced Linear Devices Inc. |
TS5MP646YFPR
|
|
36-XFBGA, DSBGA |
|
|
|
|
ebm-papst Inc. |
ICL3241EIB
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Transphorm |
PI2EQX5804DNJE
|
|
100-LBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3098EBEEE
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
PCA9506DGG,512
|
|
56-TFSOP (0.240", 6.10mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DG211DJ+
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Advanced Linear Devices Inc. |
SN54F623J
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
PCF8575DBQR
|
|
24-SSOP (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI2EQX5864CZFEX
|
|
56-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX313CSE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
ebm-papst Inc. |
HC5517BCM
|
|
28-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX13088EASA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI3EQX10964ZFEX
|
|
56-WFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
IAA110PTR
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
EL1528CRE
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
PCA9704PWJ
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
PCA9675D,112
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX338MSE/PR3+T
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
USB5916CT/KD
|
|
100-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX313LETP+
|
|
20-WQFN Exposed Pad |
|
|
|
|
Micross Components |
USB5806CT/KD
|
|
100-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX336EUI+T
|
|
28-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
KSZ8893FQL
|
|
128-BFQFP |
|
|
|
|
Advanced Linear Devices Inc. |
TRS3318EIPWR
|
|
20-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX358CWE+
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3095EPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
LAN91C113-NU
|
|
128-TQFP |
|
|
|
