|
Part Number |
|
|
|
|
Details |
|
|
|
Alpha & Omega Semiconductor Inc. |
CP82C55A-5
|
|
40-DIP (0.600", 15.24mm) |
|
|
|
|
Micross Components |
LAN9513I-JZX
|
|
64-VFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
CYPD5235-96BZXIT
|
|
96-VFBGA |
|
|
|
|
Micross Components |
USB7006/KDX
|
|
100-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3187EAX
|
|
36-BSOP (0.295", 7.50mm Width) |
|
|
|
|
Samtec Inc. |
ADG526AKPZ-REEL
|
|
28-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX329EPE+
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3232EEWE
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
onsemi |
CS8920A-CQ
|
|
144-LQFP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX13486EESA+T
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
LAN9250/ML
|
|
64-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
MIC74BQS
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX307EPI+
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
Micross Components |
USB7052N/KDX
|
|
100-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3233EEPP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
ON SEMICONDUCTOR |
PCA9674TS,118
|
|
20-LSSOP (0.173", 4.40mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TS5A4595DBVR
|
|
SC-74A, SOT-753 |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3233EEWP
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
ebm-papst Inc. |
HC5526IM
|
|
28-LCC (J-Lead) |
|
|
|
|
ON SEMICONDUCTOR |
TJR1443AT/0Z
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4802CXZ+
|
|
26-LFBGA, CSBGA |
|
|
|
|
Transphorm |
PI6ULS5V9517AUE
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
SN65LVDS1DR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
ebm-papst Inc. |
HC5515IMR4717
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
SN74LVC1G66DRLR
|
|
SOT-553 |
|
|
|
|
Quatech-Division of B&B Electronics |
HC5513BIP
|
|
22-DIP (0.400", 10.16mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX13084EASA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
ebm-papst Inc. |
HC9P5524-5R3054
|
|
|
|
|
|
|
Transphorm |
PI3EQX7502BZDE+DA
|
|
24-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX7316ATE+T
|
|
16-WFQFN Exposed Pad |
|
|
|
