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Part Number |
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Details |
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|
Laird - Wireless & Thermal Systems |
MX881RTR
|
|
16-DFN Exposed Pad |
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|
FinishAdapt Limited |
BTS5562EAUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
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|
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Omron Electronics Inc-EMC Div |
NCP5006SNT1G
|
|
SOT-23-5 Thin, TSOT-23-5 |
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FinishAdapt Limited |
BTS5566GXUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) |
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|
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|
Omron Electronics Inc-EMC Div |
NCP5602MUTBG
|
|
12-UFLGA Exposed Pad |
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FinishAdapt Limited |
BTS5572EAUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
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|
Brady Corporation |
STP16DPPS05PTR
|
|
24-SSOP (0.154", 3.90mm Width) |
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|
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Omron Electronics Inc-EMC Div |
NCP5612MUTBG
|
|
12-UFLGA Exposed Pad |
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|
|
|
FinishAdapt Limited |
BTS5662EAUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
BTS5672EAUMA2
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
FinishAdapt Limited |
BTS5682EAUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
ON SEMICONDUCTOR |
PCA9626B,118
|
|
48-LQFP |
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|
|
|
Torex Semiconductor Ltd |
BH6948GU-E2
|
|
62-VFBGA, CSPBGA |
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|
|
IXYS Integrated Circuits Division |
MAX1912EUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
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|
|
|
ON SEMICONDUCTOR |
PCA9922PW,118
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1912EUB+T
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
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|
|
|
Excelitas Technologies |
PQ1AS10C0K
|
|
- |
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|
Laird - Wireless & Thermal Systems |
MX841BE
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Laird - Wireless & Thermal Systems |
MX841BETR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Laird - Wireless & Thermal Systems |
LDS8641-008-T2
|
|
16-WFQFN Exposed Pad |
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|
|
|
Laird - Wireless & Thermal Systems |
LDS8865002-T2-250
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LT3955EUHE#TRPBF
|
|
36-WFQFN, 28 Leads, Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
LDS8846-002-T2
|
|
16-WFQFN Exposed Pad |
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|
|
|
Laird - Wireless & Thermal Systems |
LDS8640-008-T2
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
LDS8621002-T2-960
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
LDS8845-002-T2
|
|
16-WFQFN Exposed Pad |
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|
|
|
ON SEMICONDUCTOR |
PCA9901DP,118
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|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
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|
|
|
Laird - Wireless & Thermal Systems |
LDS8869-002-T2
|
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16-WFQFN Exposed Pad |
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|
|
|
ON SEMICONDUCTOR |
PCA9626BS,518
|
|
48-VFQFN Exposed Pad |
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|
|
|
Omron Electronics Inc-EMC Div |
NCP5604AMTR2G
|
|
16-WFQFN Exposed Pad |
|
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|
