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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
ON SEMICONDUCTOR
MPC870VR133
256-BBGA
FinishAdapt Limited
MB90F022CPF-GS-9063
Rittal
MC68EC020AA25R
100-BQFP
ON SEMICONDUCTOR
MPC885VR66-NXP
357-BBGA
Rittal
MCIMX515DVK8C
527-LFBGA
FinishAdapt Limited
MB90F022CPF-GS-9051
FinishAdapt Limited
MB90F022CPF-GS-9052
Advanced Linear Devices Inc.
TIET890AGA
Alpha & Omega Semiconductor Inc.
HD64F3642AWV
Rittal
MCIMX31LDVMN5D
473-LFBGA
ON SEMICONDUCTOR
MCIMX6U1AVM08ADR
624-LFBGA
FinishAdapt Limited
MB90F022CPF-GS-9049
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
IBM25PPC750FL-GB0223T
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
IBM25PPC750GLECR2HA3T
292-BCBGA Exposed Pad
FinishAdapt Limited
MB90F022CPF-GS-9053
FinishAdapt Limited
MB90F022CPF-GS-9057
Advanced Thermal Solutions Inc.
RH80530NZ014256
VersaLogic Corporation
MIMX8ML4DVNLZAB
548-LFBGA
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
IBM25PPC750FL-GB0123V
FinishAdapt Limited
MB90F022CPF-GS-9060
Rittal
MPC8358EZQAGDDA
668-BBGA Exposed Pad
FinishAdapt Limited
MB90F022CPF-GS-9095
ON SEMICONDUCTOR
MCIMX6U5EVM10ADR
624-LFBGA
ON SEMICONDUCTOR
LS1022AXE7EKB
525-FBGA, FCBGA
FinishAdapt Limited
MB90F022CPF-GS-9059
ON SEMICONDUCTOR
MC68340CAG16E-NXP
FinishAdapt Limited
MB90F022CPF-GS-9068
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
IBM25PPC750FL-GR1033V
Advanced Thermal Solutions Inc.
RJ80530GZ009512
479-BGA
FinishAdapt Limited
MB90F022CPF-GS-9078