|
Part Number |
|
|
|
|
Details |
|
|
|
FinishAdapt Limited |
SAK-XE164KN-16F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
LM3S811-IQN50-C2T
|
|
48-LQFP |
|
|
|
|
Advanced Linear Devices Inc. |
MSP430F5333IPZ
|
|
100-LQFP |
|
|
|
|
ON SEMICONDUCTOR |
MCIMX7D5EVM10SC557
|
|
|
|
|
|
|
FinishAdapt Limited |
SAK-XE162FN-24F80L AA
|
|
64-LQFP Exposed Pad |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX280HH3F55E1VGS3
|
|
2912-BBGA, FCBGA |
|
|
|
|
ON SEMICONDUCTOR |
MPC8250AZUPIBC557
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX32561-LBS+
|
|
100-TFBGA |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-162-BNDE1
|
|
64-LQFP |
|
|
|
|
Advanced Linear Devices Inc. |
MSP430F2416TPNR
|
|
80-LQFP |
|
|
|
|
Brady Corporation |
SPC564L54L3CBOQR
|
|
100-LQFP |
|
|
|
|
FinishAdapt Limited |
SAK-XE162HN-16F80L AA
|
|
64-LQFP Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX32570-QNJ+
|
|
169-TFBGA |
|
|
|
|
Micross Components |
TS87C54X2-MCC
|
|
44-QFP |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-164E1
|
|
64-LQFP |
|
|
|
|
Micross Components |
TS80C32X2-LIC
|
|
44-QFP |
|
|
|
|
Micross Components |
TS80C31X2-MCC
|
|
44-QFP |
|
|
|
|
ON SEMICONDUCTOR |
MCIMX6V2CVM08AB557
|
|
|
|
|
|
|
Micross Components |
TS87C52X2-MIC
|
|
44-QFP |
|
|
|
|
Advanced Thermal Solutions Inc. |
1SX280LU3F50E2VG
|
|
2397-BBGA, FCBGA |
|
|
|
|
Brady Corporation |
STR755FV0T6
|
|
100-LQFP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX32570-QNS+
|
|
169-TFBGA |
|
|
|
|
Brady Corporation |
SPC564L64L3CBFSY
|
|
100-LQFP |
|
|
|
|
Micross Components |
TS80C31X2-VIC
|
|
44-QFP |
|
|
|
|
Rittal |
MVF50NS151CMK40
|
|
364-LFBGA |
|
|
|
|
ON SEMICONDUCTOR |
MCIMX6G1AVM07AA557
|
|
|
|
|
|
|
FinishAdapt Limited |
SAK-XE164GN-24F80L AA
|
|
100-LQFP Exposed Pad |
|
|
|
|
FinishAdapt Limited |
MB90497GPMC-GS-196E1
|
|
64-LQFP |
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
25PPC970-30B25A3T
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
TM4C1237H6PZI7R
|
|
100-LQFP |
|
|
|
