|
Part Number |
|
|
|
|
Details |
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750FL-GR1033V
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
RJ80530GZ009512
|
|
479-BGA |
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9068
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750CXEJR7012T
|
|
|
|
|
|
Rittal |
MPC857TZQ50B
|
|
357-BBGA |
|
|
|
ON SEMICONDUCTOR |
MCIMX6U8DVM10AC
|
|
624-LFBGA |
|
|
|
Rittal |
MC68340AG25E
|
|
144-LQFP |
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9088
|
|
|
|
|
|
Advanced Thermal Solutions Inc. |
RJ80530NZ001256
|
|
479-BBGA, FCBGA |
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9064
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9067
|
|
|
|
|
|
BeagleBoard.org |
D8155H-2
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9069
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
D6417750SVBT133V
|
|
|
|
|
|
ON SEMICONDUCTOR |
MPC8308CVMAGDA
|
|
473-LFBGA |
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
25PPC750FX-FB0512T
|
|
292-BCBGA Exposed Pad |
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750FL-GB0123T
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9087
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9091
|
|
|
|
|
|
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
IBM25PPC750FL-GR0124V
|
|
|
|
|
|
Rittal |
P1013NSE2EFB
|
|
689-BBGA Exposed Pad |
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9093
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9075
|
|
|
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9096
|
|
|
|
|
|
ON SEMICONDUCTOR |
MCIMX6U1AVM08ACR
|
|
624-LFBGA |
|
|
|
ON SEMICONDUCTOR |
MCIMX31DVKN5D
|
|
457-LFBGA |
|
|
|
Rittal |
MC68HC001EI8
|
|
68-LCC (J-Lead) |
|
|
|
ON SEMICONDUCTOR |
MPC8313EVRADDC
|
|
516-BBGA Exposed Pad |
|
|
|
Rittal |
XPC8240LVV200E
|
|
352-LBGA |
|
|
|
FinishAdapt Limited |
MB90F022CPF-GS-9084
|
|
|
|
|