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Part Number |
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Details |
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IXYS Integrated Circuits Division |
MAX31785AETL+
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|
40-WFQFN Exposed Pad |
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Terasic Inc. |
NJM2670E3-TE2
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24-SOIC (0.295", 7.50mm Width) |
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IXYS Integrated Circuits Division |
TMC5031-LA
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|
48-VFQFN Exposed Pad |
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Omron Electronics Inc-EMC Div |
LV8907UWR2G
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48-LQFP Exposed Pad |
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HARRIS SEMICONDUCTOR |
SIM6897M
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40-DIP (0.657", 16.70mm), 29 Leads |
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EMAC, Inc. |
FSB43004A
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|
22-DIP Module |
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IXYS Integrated Circuits Division |
TMC5072-LA
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|
48-VFQFN Exposed Pad |
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|
Brady Corporation |
E-L6258
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36-PowerBSSOP (0.433", 11.00mm Width) |
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|
IXYS Integrated Circuits Division |
TMC5062-LA
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|
48-VFQFN Exposed Pad |
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|
IXYS Integrated Circuits Division |
TMC429-PI24
|
|
24-SOIC (0.295", 7.50mm Width) |
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|
IXYS Integrated Circuits Division |
TMC249A-SA
|
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28-SOIC (0.295", 7.50mm Width) |
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Torex Semiconductor Ltd |
BM6249FS-E2
|
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54-SOP (0.449", 11.40mm Width), 36 Leads |
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PulseR |
TMC246B-PA
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|
44-LQFP |
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NetBurner Inc. |
NCT3941S TR
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8-SOIC (0.154", 3.90mm Width) Exposed Pad |
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Terasic Inc. |
NJM3770AE2-TE2
|
|
20-SOIC (0.209", 5.30mm Width) |
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|
|
NetBurner Inc. |
NCT3941S-A TR
|
|
8-SOIC (0.154", 3.90mm Width) Exposed Pad |
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|
|
Transphorm |
AH9485-WUF-7
|
|
SOT-23-6 Thin, TSOT-23-6 |
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|
Transphorm |
AH9486-WUF-7
|
|
SOT-23-6 Thin, TSOT-23-6 |
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|
|
EMAC, Inc. |
FPAL30SL60
|
|
30-PowerDIP Module |
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|
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HARRIS SEMICONDUCTOR |
SIM2602M
|
|
40-DIP (0.657", 16.70mm), 29 Leads |
|
|
|
HARRIS SEMICONDUCTOR |
SCM1274MF
|
|
33-PowerDIP (1.307", 33.20mm) |
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HARRIS SEMICONDUCTOR |
SCM1276MF
|
|
33-PowerDIP (1.307", 33.20mm) |
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|
|
IXYS Integrated Circuits Division |
TMC249A-LA
|
|
32-VQFN Exposed Pad |
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|
|
Transphorm |
AM4406FMTR-G1
|
|
8-SOIC (0.154", 3.90mm Width) |
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|
|
IXYS Integrated Circuits Division |
TMC457-BC
|
|
144-LBGA |
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|
|
Omron Electronics Inc-EMC Div |
LV8961HUWR2G
|
|
48-LQFP Exposed Pad |
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|
|
Transphorm |
AH5773-FDC-7
|
|
6-UDFN Exposed Pad |
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|
|
HARRIS SEMICONDUCTOR |
SCM1272MA
|
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33-PowerDIP (1.307", 33.20mm) |
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SolaHD |
UC1717J883B
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Transphorm |
AM4962GSTR-G1
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16-SSOP (0.154", 3.90mm Width) |
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