|
Part Number |
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|
|
|
Details |
|
|
|
IXYS Integrated Circuits Division |
MAX7312AWG+T
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2186S/T&R
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
MC33170DTBR2
|
|
|
|
|
|
|
Walsin Technology Corporation |
DG408DJ-E3
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
FinishAdapt Limited |
CY7B923-SC
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Micross Components |
VSC8541XMV-02
|
|
68-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3243ICAI
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4581ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
SSTUB32S869BHLFT
|
|
150-TFBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX7315AEE
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
Samtec Inc. |
LTC1380IS#TRPBF
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Sumida Corporation |
W5300
|
|
100-LQFP |
|
|
|
|
Micross Components |
VSC8501XML
|
|
- |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3217IA
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Micross Components |
VSC7429XJG-02
|
|
672-BGA |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3222CPZ
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
USB5806C-I/KD
|
|
100-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADM3311EACPZ
|
|
32-WFQFN Exposed Pad, CSP |
|
|
|
|
Honeywell Sensing and Productivity Solutions |
CP2103-GM
|
|
28-VFQFN Exposed Pad |
|
|
|
|
Samtec Inc. |
ADG708CRUZ-REEL
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Transphorm |
PI2EQX4402DNBE
|
|
84-LFBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAX1480ACPI
|
|
28-DIP (0.600", 15.24mm) |
|
|
|
|
Samtec Inc. |
ADG1633BRUZ-REEL7
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Quatech-Division of B&B Electronics |
ICL3217ECB
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
SN65HVD21P
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
ebm-papst Inc. |
CDP6823Q
|
|
44-LCC (J-Lead) |
|
|
|
|
Walsin Technology Corporation |
DG506BEW-T1-GE3
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
ebm-papst Inc. |
ICL232CPER2489
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX1489ECPD
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX485CUA
|
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
|
|
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