|
Part Number |
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|
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|
Details |
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|
|
IXYS Integrated Circuits Division |
MAX312ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
IXYS Integrated Circuits Division |
MAX312CUE+
|
|
16-TSSOP (0.173", 4.40mm Width) |
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|
|
|
Advanced Linear Devices Inc. |
PCF8575CPWR
|
|
24-TSSOP (0.173", 4.40mm Width) |
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|
IXYS Integrated Circuits Division |
DG403DY+
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
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|
IXYS Integrated Circuits Division |
MAX3098EACSE
|
|
16-SOIC (0.154", 3.90mm Width) |
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|
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|
IXYS Integrated Circuits Division |
MAX359EPE+
|
|
|
|
|
|
|
Micross Components |
MCP2140A-I/P
|
|
18-DIP (0.300", 7.62mm) |
|
|
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|
Transphorm |
PI2EQX8804ANJEX
|
|
100-LBGA |
|
|
|
|
Sanyo Denki America Inc. |
BDGLA16P
|
|
- |
|
|
|
|
ON SEMICONDUCTOR |
PCA9670D,512
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3098EAEPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
LAN9118-MT
|
|
100-LQFP |
|
|
|
|
Omron Electronics Inc-EMC Div |
FIN1047MX
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TCAN1051HGVDRBRQ1
|
|
8-VDFN Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL8485ECBZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3080ECSD
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
ebm-papst Inc. |
HC55130IM
|
|
28-LCC (J-Lead) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX396CWI+
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3096EEE
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TCAN1042GDRQ1
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ISL8485EIBZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX378CWG+T
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX358EPE+
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4533EPP+
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
Transphorm |
PI3EQX10908ZFE
|
|
56-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DG528DJ+
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
ON SEMICONDUCTOR |
PCA9670D,518
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX13088EASA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Transphorm |
PI3EQX10964ZFEX
|
|
56-WFQFN Exposed Pad |
|
|
|
|
Laird - Wireless & Thermal Systems |
IAA110PTR
|
|
16-SOIC (0.295", 7.50mm Width) |
|
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