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Sensor, Capacitive Touch

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
IXYS Integrated Circuits Division
MAX22520GWP+
Micross Components
CAP1206-1-AIA-TR
10-VFDFN Exposed Pad
Steward
IQS7211A101CSR
18-UFBGA, WLCSP
Laird Technologies - Thermal Materials
IS31SE5111A-ZNLS3-TR
24-TSSOP (0.173", 4.40mm Width)
Laird Technologies - Thermal Materials
IS31SE5111C-ZNLS3-TR
16-TSSOP (0.173", 4.40mm Width)
Micross Components
AT42QT1110-AUR
32-TQFP
Steward
IQS680-100-DNR
10-WFDFN Exposed Pad
Steward
IQS7222C101CSR
18-UFBGA, WLCSP
Alpha & Omega Semiconductor Inc.
LDS6107PYGI8
28-SSOP (0.209", 5.30mm Width)
Brady Corporation
STMPE821QTR
16-UFQFN
Steward
IQS7222A001QNR
20-UFQFN Exposed Pad
Advanced Linear Devices Inc.
FDC2214QRGHRQ1
16-WFQFN Exposed Pad
Brady Corporation
STMPE16M31PXQTR
32-VFQFN Exposed Pad
Laird Technologies - Thermal Materials
IS32SE5117-QWLA3-TR
24-WFQFN Exposed Pad
Advanced Linear Devices Inc.
FDC2214RGHT
16-WFQFN Exposed Pad
Laird Technologies - Thermal Materials
IS31SE5111C-ZNLS3
16-TSSOP (0.173", 4.40mm Width)
Micross Components
AT42QT2120-SU
20-SOIC (0.295", 7.50mm Width)
Micross Components
CAP1208-1-A4-TR
16-VFQFN Exposed Pad
FinishAdapt Limited
CY8CMBR3002-SX1IT
8-SOIC (0.154", 3.90mm Width)
Alpha & Omega Semiconductor Inc.
LDS6124NQGI
28-WFQFN Exposed Pad
Omron Electronics Inc-EMC Div
LC717A00AJ-AH
30-SSOP
Advanced Linear Devices Inc.
FDC1004DGSR
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Laird Technologies - Thermal Materials
IS31SE5100-SALS2
24-SSOP (0.209", 5.30mm Width)
Honeywell Sensing and Productivity Solutions
CPT112S-A02-GM
20-UFQFN Exposed Pad
Panasonic - DTG
AT42QT2160-MMU
28-VFQFN Exposed Pad
Laird Technologies - Thermal Materials
IS31SE5111A-ZNLS3
24-TSSOP (0.173", 4.40mm Width)
Micross Components
AT42QT1050-MMH
20-VFQFN Exposed Pad
Laird Technologies - Thermal Materials
IS31SE5118-ZNLS3-TR
16-TSSOP (0.173", 4.40mm Width)
Omron Electronics Inc-EMC Div
LC717A00AR-NH
28-VFQFN
Advanced Linear Devices Inc.
FDC1004QDGSTQ1
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)