|
Part Number |
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|
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|
Details |
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|
|
Steward |
IQS7211A101CSR
|
|
18-UFBGA, WLCSP |
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|
|
|
Steward |
IQS7222A001CSR
|
|
18-UFBGA, WLCSP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX22520GWP+
|
|
|
|
|
|
|
Steward |
IQS680-100-DNR
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Steward |
IQS7222C101CSR
|
|
18-UFBGA, WLCSP |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5111A-ZNLS3-TR
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5111C-ZNLS3-TR
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
AT42QT1110-AUR
|
|
32-TQFP |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
LDS6107PYGI8
|
|
28-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Brady Corporation |
STMPE821QTR
|
|
16-UFQFN |
|
|
|
|
Brady Corporation |
STMPE16M31PXQTR
|
|
32-VFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS32SE5117-QWLA3-TR
|
|
24-WFQFN Exposed Pad |
|
|
|
|
Steward |
IQS7222A001QNR
|
|
20-UFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
FDC2214QRGHRQ1
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Micross Components |
CAP1208-1-A4-TR
|
|
16-VFQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
CY8CMBR3002-SX1IT
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
FDC2214RGHT
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5111C-ZNLS3
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Micross Components |
AT42QT2120-SU
|
|
20-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LC717A00AJ-AH
|
|
30-SSOP |
|
|
|
|
Advanced Linear Devices Inc. |
FDC1004DGSR
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
LDS6124NQGI
|
|
28-WFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5100-SALS2
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Honeywell Sensing and Productivity Solutions |
CPT112S-A02-GM
|
|
20-UFQFN Exposed Pad |
|
|
|
|
Panasonic - DTG |
AT42QT2160-MMU
|
|
28-VFQFN Exposed Pad |
|
|
|
|
Micross Components |
AT42QT1050-MMH
|
|
20-VFQFN Exposed Pad |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5118-ZNLS3-TR
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5111A-ZNLS3
|
|
24-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
FDC1004QDGSTQ1
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Laird Technologies - Thermal Materials |
IS31SE5117-QFLS3-TR
|
|
24-WFQFN Exposed Pad |
|
|
|
