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Part Number |
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|
Details |
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|
IXYS Integrated Circuits Division |
DG413FDY+
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16-SOIC (0.154", 3.90mm Width) |
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Ellsworth Adhesives |
R6785-25
|
|
|
|
|
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Micross Components |
LAN7800-I/Y9X
|
|
48-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX4651EGE
|
|
16-VQFN Exposed Pad |
|
|
|
ON SEMICONDUCTOR |
ASC8848AET
|
|
|
|
|
|
Samtec Inc. |
LTC1483CS8#TRPBF
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Samtec Inc. |
ADM207ARS
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
Samtec Inc. |
ADM207EAN
|
|
24-DIP (0.300", 7.62mm) |
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|
|
IXYS Integrated Circuits Division |
MAX4685ETB
|
|
10-WFDFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
ISL1539IRZ-T13
|
|
24-VFQFN Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
UCC5639FQP
|
|
48-LQFP |
|
|
|
Samtec Inc. |
ADM206ARS-REEL
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
Inphi Corporation |
LA1773M-A-MPB-E
|
|
|
|
|
|
Ellsworth Adhesives |
CX88168-11
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4666ESE+
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
Advanced Linear Devices Inc. |
TNETD4200GJL240
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX4736ETC
|
|
12-WFQFN Exposed Pad |
|
|
|
Samtec Inc. |
ADM213AR
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
Micross Components |
KSZ8563RNXI-TR
|
|
64-VFQFN Exposed Pad |
|
|
|
Samtec Inc. |
LTC2852IDD#TRPBF
|
|
10-WFDFN Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
UCC5614PWP
|
|
24-PowerTSSOP (0.173", 4.40mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX9123EUE
|
|
16-TSSOP (0.173", 4.40mm Width) |
|
|
|
Micross Components |
KSZ9563RNXI-TR
|
|
64-VFQFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
ISL81487EIP
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
Micross Components |
LAN7430-I/Y9X
|
|
48-VFQFN Exposed Pad |
|
|
|
Micross Components |
KSZ9896CTXC
|
|
128-TQFP Exposed Pad |
|
|
|
FinishAdapt Limited |
PEF55016EV1.3-G
|
|
|
|
|
|
ON SEMICONDUCTOR |
CBTL04083ABS,558
|
|
|
|
|
|
Advanced Linear Devices Inc. |
UCC5630AFQP
|
|
48-LQFP |
|
|
|
FinishAdapt Limited |
PEB31665HV1.2D
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