|
Part Number |
|
|
|
|
Details |
|
|
IXYS Integrated Circuits Division |
MAX3420EECJ/V+
|
|
32-LQFP |
|
|
|
ON SEMICONDUCTOR |
TEA19051BAAT/1J
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
Honeywell Sensing and Productivity Solutions |
CP2102N-A01-GQFN28R
|
|
28-WFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX5969CETE+
|
|
16-WQFN Exposed Pad |
|
|
|
Micross Components |
USB5434-3083JZX-TR
|
|
64-VFQFN Exposed Pad |
|
|
|
Micross Components |
MCP2210-I/SSVAO
|
|
20-SSOP (0.209", 5.30mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX3420EECJ/V+T
|
|
32-LQFP |
|
|
|
FinishAdapt Limited |
CYUSB3343-BZXI
|
|
121-TFBGA |
|
|
|
Brady Corporation |
STUSB4710ADTR
|
|
16-SOIC (0.154", 3.90mm Width) |
|
|
|
Micross Components |
USB5534-3089JZXTR
|
|
64-VFQFN Exposed Pad |
|
|
|
Micross Components |
MCP2515-E/MLVAO
|
|
20-VFQFN Exposed Pad |
|
|
|
Micross Components |
USB5534-JZX-TR
|
|
64-VFQFN Exposed Pad |
|
|
|
FinishAdapt Limited |
CP8912AT
|
|
|
|
|
|
Honeywell Sensing and Productivity Solutions |
CP2112-F02-GMR
|
|
24-WFQFN Exposed Pad |
|
|
|
Z-World |
BCM53124AKMMLG
|
|
- |
|
|
|
Z-World |
BCM53161XUB0KLFBG
|
|
- |
|
|
|
FinishAdapt Limited |
CP8912ATT
|
|
|
|
|
|
Z-World |
BCM53124B0MKMMLG
|
|
- |
|
|
|
Z-World |
BCM53162XMB0ILFBG
|
|
- |
|
|
|
Sumida Corporation |
W3150A+
|
|
64-LQFP |
|
|
|
Z-World |
BCM53124UKMMLG
|
|
- |
|
|
|
Honeywell Sensing and Productivity Solutions |
CP2130-F01-GMR
|
|
24-WFQFN Exposed Pad |
|
|
|
Micross Components |
USB2514B-AEZG-TR
|
|
36-VFQFN Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX3421EEHJ+CC2
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX3100EEE+TG05
|
|
|
|
|
|
IXYS Integrated Circuits Division |
DS2483AQ+U
|
|
8-WFDFN Exposed Pad |
|
|
|
Z-World |
BCM53112MB0ILFBG
|
|
- |
|
|
|
Honeywell Sensing and Productivity Solutions |
CP2102N-A01-GQFN20R
|
|
20-WFQFN Exposed Pad |
|
|
|
Micross Components |
USB5537-3089AKZE
|
|
72-VFQFN Exposed Pad |
|
|
|
Z-World |
BCM53156XMB0KFBG
|
|
- |
|
|