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Interface

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
MaxLinear, Inc.
SI32284-A-ZM2R
48-VFQFN Exposed Pad
ON SEMICONDUCTOR
NX3V1T66GM,115
6-XFDFN
IXYS Integrated Circuits Division
MAX4602CPE+
16-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX4623CPE+
16-DIP (0.300", 7.62mm)
ON SEMICONDUCTOR
TEF7006HN/V1,518
Sumida Corporation
WIZ750SR-232
Module
KE Kitagawa
TD501D485H-E
10-DIP Module, 8 Leads
Micross Components
KSZ8873FLL
64-LQFP
Advanced Linear Devices Inc.
TRS3386ECPW
20-TSSOP (0.173", 4.40mm Width)
ON SEMICONDUCTOR
NX3V1T66GM,132
6-XFDFN
Wandboard.Org
74LVC1G3157GM,132
6-XFDFN
Advanced Linear Devices Inc.
SN75C3221EDB
16-SSOP (0.209", 5.30mm Width)
Alpha & Omega Semiconductor Inc.
HIN202ECBN
16-SOIC (0.154", 3.90mm Width)
Alpha & Omega Semiconductor Inc.
ICL3225EIA
20-SSOP (0.209", 5.30mm Width)
Advanced Linear Devices Inc.
SN65C3221DB
16-SSOP (0.209", 5.30mm Width)
Alpha & Omega Semiconductor Inc.
HIN202EIBN
16-SOIC (0.154", 3.90mm Width)
Laird - Wireless & Thermal Systems
CPC7695BC
28-SOIC (0.295", 7.50mm Width)
Micross Components
USB2241I-AEZG-06
36-VFQFN Exposed Pad
Murata Power Solutions Inc.
50010R-10
Module
Advanced Linear Devices Inc.
DAC8742HPBSR
32-TQFP
Transphorm
ZXFV301N16TA
16-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX4590EWE+
16-SOIC (0.295", 7.50mm Width)
MaxLinear, Inc.
SI32260-C-FM2
47-VFQFN Exposed Pad
Micross Components
LAN9117-MT
100-TQFP
IXYS Integrated Circuits Division
MAX33048EASA+
Wandboard.Org
74LV4052DB,118
16-SSOP (0.209", 5.30mm Width)
ON SEMICONDUCTOR
NX3L1T3157GM,115
6-XFDFN
Toko
TEP0001-01
Module
IXYS Integrated Circuits Division
MAX4663CAE+
16-SSOP (0.209", 5.30mm Width)
Micross Components
LE79271MQCT
28-VFQFN Exposed Pad