|
Part Number |
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|
Details |
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|
IXYS Integrated Circuits Division |
MAXBBTDFN3X3-8#
|
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IXYS Integrated Circuits Division |
MAX98504EWV+
|
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|
|
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|
IXYS Integrated Circuits Division |
MAX9723AEBE+
|
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|
IXYS Integrated Circuits Division |
MAX98708BENA+TG7
|
|
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|
|
|
|
Raltron Electronics |
MP7782DF-LF-P
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
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|
Laird Technologies - Thermal Materials |
IS31AP2145E-UTLS2-TR
|
|
9-UFBGA |
|
|
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|
IXYS Integrated Circuits Division |
MAX4411EBE+
|
|
16-WFBGA, CSPBGA |
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|
onsemi |
CS35L45-CWZR
|
|
36-BGA, WLCSP |
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Terasic Inc. |
NJM2179D
|
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Terasic Inc. |
NJM2135L
|
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Terasic Inc. |
NJM2188D
|
|
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|
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|
Advanced Linear Devices Inc. |
LM1877M-9/NOPB
|
|
14-SOIC (0.295", 7.50mm Width) |
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|
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|
All Flex Inc. |
AS3561
|
|
16-UFBGA, WLCSP |
|
|
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|
FinishAdapt Limited |
98-1059PBF
|
|
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|
|
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|
All Flex Inc. |
AS1705V-T-Z
|
|
10-WFDFN Exposed Pad |
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|
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|
Terasic Inc. |
NJM2190D
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718EEBL+G45
|
|
9-WFBGA, WLBGA |
|
|
|
|
All Flex Inc. |
AS1703V-T-Z
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
NJW1109D
|
|
|
|
|
|
|
Advanced Linear Devices Inc. |
LM3875T
|
|
TO-220-11 (Formed Leads) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718EEBL+TG45
|
|
9-WFBGA, WLBGA |
|
|
|
|
All Flex Inc. |
AS3625-ZWLT
|
|
|
|
|
|
|
EPCOS (TDK) |
IS32AP2123-ZLA3
|
|
16-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
|
Terasic Inc. |
NJM2199D
|
|
|
|
|
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|
onsemi |
CS35L37-CWZR
|
|
|
|
|
|
|
All Flex Inc. |
AS1702V-T-Z
|
|
10-WFDFN Exposed Pad |
|
|
|
|
Terasic Inc. |
NJW1159D
|
|
|
|
|
|
|
All Flex Inc. |
AS3535
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718DETB+
|
|
10-WFDFN Exposed Pad |
|
|
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|
Terasic Inc. |
NJM2113L
|
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|
