|
Part Number |
|
|
|
|
Details |
|
|
|
Alpha & Omega Semiconductor Inc. |
80HSPS1616CBR
|
|
400-BBGA, FCBGA |
|
|
|
|
IXYS Integrated Circuits Division |
DS28EL15Q-742+3TW
|
|
- |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HSPS1616CBRI
|
|
400-BBGA, FCBGA |
|
|
|
|
Omron Electronics Inc-EMC Div |
FSSD07BQX
|
|
24-WFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DS28EL15Q-742+4TW
|
|
- |
|
|
|
|
Omron Electronics Inc-EMC Div |
FSSD07UMX
|
|
24-UFQFN |
|
|
|
|
IXYS Integrated Circuits Division |
DS28EL15Q-742+5TW
|
|
- |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HCPS1848CHMGI
|
|
784-BBGA, FCBGA |
|
|
|
|
IXYS Integrated Circuits Division |
DS28EL15Q-742+6TW
|
|
- |
|
|
|
|
IXYS Integrated Circuits Division |
DS3164+
|
|
400-BBGA |
|
|
|
|
IXYS Integrated Circuits Division |
MAXQ1061EUD+
|
|
14-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
FinishAdapt Limited |
TLE8261-2E
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
Micross Components |
AT88SA102S-SH-T
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
TLE8264EXUMA4
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HCPS1432CHMG
|
|
576-BBGA, FCBGA |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HCPS1616CHMG
|
|
400-BBGA, FCBGA |
|
|
|
|
Transphorm |
PT8A2511WE
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HCPS1616CHMGI
|
|
400-BBGA, FCBGA |
|
|
|
|
Micross Components |
AT88SC0404CA-TH
|
|
8-TSSOP (0.173", 4.40mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
80HCPS1848CBLG
|
|
784-BBGA, FCBGA |
|
|
|
|
FinishAdapt Limited |
TLE8263EXUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
CML Microcircuits |
CAP018DG
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
FinishAdapt Limited |
TLE82642EXUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
CML Microcircuits |
CAP019DG
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
CM2030-A0TR
|
|
38-TFSOP (0.173", 4.40mm Width) |
|
|
|
|
FinishAdapt Limited |
TLE8264EXUMA1
|
|
36-BSSOP (0.295", 7.50mm Width) Exposed Pad |
|
|
|
|
Micross Components |
AT88SC0104C-MJTG
|
|
M2 J, Smart Card Module (TWI) |
|
|
|
|
CML Microcircuits |
CAP003DG
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
CML Microcircuits |
CAP004DG
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX4845CEYT+T
|
|
6-UFLGA |
|
|
|
