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Interface

Img
Part Number
Manufacturers
Desc
Enquiry
Packing
Details
BeagleBoard.org
26LS32/BEA
NMB Technologies Corporation
5962-8757502QA
40-CDIP
Advanced Linear Devices Inc.
5962-87809012A
Alpha & Omega Semiconductor Inc.
RAA2S4251B5HWT#AFE
Die
Samtec Inc.
LT1039ACN#PBF
18-DIP (0.300", 7.62mm)
Samtec Inc.
LT1032CSW#PBF
16-SOIC (0.295", 7.50mm Width)
Laird - Wireless & Thermal Systems
TS118S
8-SMD, Gull Wing
IXYS Integrated Circuits Division
DS2154LD1
100-LQFP
IXYS Integrated Circuits Division
DS2143QN/T&R
44-LCC (J-Lead)
Micross Components
MCP96L01-E/MX
20-VQFN Exposed Pad
Micross Components
AY-6-1013
Pulse Electronics Power
MLX90328LDC-DBA-000-SP
8-SOIC (0.154", 3.90mm Width)
Laird - Wireless & Thermal Systems
TS122
8-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
DS2175S/T&R
16-SOIC (0.295", 7.50mm Width)
Transphorm
PI3HDX511FZLCEX
40-WFQFN Exposed Pad
Samtec Inc.
LTC1690CN8#PBF
8-DIP (0.300", 7.62mm)
Micross Components
MCP96L00-E/MX
20-VQFN Exposed Pad
FinishAdapt Limited
PEF22810T-V21TR
8-SOIC (0.154", 3.90mm Width)
Alpha & Omega Semiconductor Inc.
HIN241CB
28-SOIC (0.295", 7.50mm Width)
Alpha & Omega Semiconductor Inc.
ICL3207CAZ
24-SSOP (0.209", 5.30mm Width)
Advanced Linear Devices Inc.
TNETA1500APGE
IXYS Integrated Circuits Division
MAX35101EHJ+T
32-TQFP Exposed Pad
Alpha & Omega Semiconductor Inc.
HIN238CPZ
24-DIP (0.300", 7.62mm)
TDK-EPC
TDC-GP30YD-F01 3K
32-VFQFN Exposed Pad
Advanced Linear Devices Inc.
5962-9087001MKA
Quatech-Division of B&B Electronics
CP82C89
20-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
DS2151QN/T&R
44-LCC (J-Lead)
Laird - Wireless & Thermal Systems
CYG2030
18-DIP Module (0.850", 21.59mm), 11 Leads
Advanced Linear Devices Inc.
SNJ55501CJ
Transphorm
PI3HDX511EZLSEX
32-WFQFN Exposed Pad