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Part Number |
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Details |
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Laird - Wireless & Thermal Systems |
CYG2111
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18-DIP Module (0.850", 21.59mm), 9 Leads |
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Abracon |
CMX683D4
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16-SOIC (0.295", 7.50mm Width) |
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MaxLinear, Inc. |
SI32184-A-FM
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|
40-VFQFN Exposed Pad |
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ebm-papst Inc. |
HC5515IP
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22-DIP (0.400", 10.16mm) |
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Quatech-Division of B&B Electronics |
HC55143IM
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32-LCC (J-Lead) |
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FinishAdapt Limited |
PSB8430ZDW
|
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Micross Components |
ZL50020GAG2
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256-BGA |
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Alpha & Omega Semiconductor Inc. |
ISL5585BIMZ-T
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28-LCC (J-Lead) |
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Quatech-Division of B&B Electronics |
HC5547CMS2584
|
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MaxLinear, Inc. |
SI32287-A-GMR
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56-VFQFN Exposed Pad |
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MaxLinear, Inc. |
SI32171-C-GM1R
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42-WFQFN Exposed Pad |
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FinishAdapt Limited |
PEB7274HV1.2
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Z-World |
BCM65239C0IFSBG
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- |
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Z-World |
BCM68385CIFSBG
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- |
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IXYS Integrated Circuits Division |
DS2175S+T&R
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16-SOIC (0.295", 7.50mm Width) |
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IXYS Integrated Circuits Division |
DS2155L
|
|
100-LQFP |
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Laird - Wireless & Thermal Systems |
M-984-02P
|
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14-DIP (0.300", 7.62mm) |
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IXYS Integrated Circuits Division |
DS2156L+
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|
100-LQFP |
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Z-World |
BCM56072A0KFSBG
|
|
896-BFBGA, FCBGA |
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FinishAdapt Limited |
PSB 6970 HL V1.3
|
|
100-LQFP Exposed Pad |
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|
Laird - Wireless & Thermal Systems |
CPC7581MC
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16-VDFN Exposed Pad |
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IXYS Integrated Circuits Division |
73M1866B-IMR/F
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|
42-VFQFN Exposed Pad |
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|
Quatech-Division of B&B Electronics |
HC9P5504B-5
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24-SOIC (0.295", 7.50mm Width) |
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|
Laird - Wireless & Thermal Systems |
TS190PTR
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8-SMD, Gull Wing |
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FinishAdapt Limited |
CYV15G0404RB-BGC
|
|
256-BGA Exposed Pad |
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ebm-papst Inc. |
HC3-5504-5X154
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FinishAdapt Limited |
PEF22624EV1.3-G
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|
324-LBGA |
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Laird - Wireless & Thermal Systems |
CPC7581MB
|
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16-VDFN Exposed Pad |
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|
ON SEMICONDUCTOR |
TDA18264HB/C1
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80-TFQFN Exposed Pad |
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Z-World |
BCM56626B2IFSBLG
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