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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Laird - Wireless & Thermal Systems
CYG2111
18-DIP Module (0.850", 21.59mm), 9 Leads
Abracon
CMX683D4
16-SOIC (0.295", 7.50mm Width)
MaxLinear, Inc.
SI32184-A-FM
40-VFQFN Exposed Pad
ebm-papst Inc.
HC5515IP
22-DIP (0.400", 10.16mm)
Quatech-Division of B&B Electronics
HC55143IM
32-LCC (J-Lead)
FinishAdapt Limited
PSB8430ZDW
Micross Components
ZL50020GAG2
256-BGA
Alpha & Omega Semiconductor Inc.
ISL5585BIMZ-T
28-LCC (J-Lead)
Quatech-Division of B&B Electronics
HC5547CMS2584
MaxLinear, Inc.
SI32287-A-GMR
56-VFQFN Exposed Pad
MaxLinear, Inc.
SI32171-C-GM1R
42-WFQFN Exposed Pad
FinishAdapt Limited
PEB7274HV1.2
Z-World
BCM65239C0IFSBG
-
Z-World
BCM68385CIFSBG
-
IXYS Integrated Circuits Division
DS2175S+T&R
16-SOIC (0.295", 7.50mm Width)
IXYS Integrated Circuits Division
DS2155L
100-LQFP
Laird - Wireless & Thermal Systems
M-984-02P
14-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
DS2156L+
100-LQFP
Z-World
BCM56072A0KFSBG
896-BFBGA, FCBGA
FinishAdapt Limited
PSB 6970 HL V1.3
100-LQFP Exposed Pad
Laird - Wireless & Thermal Systems
CPC7581MC
16-VDFN Exposed Pad
IXYS Integrated Circuits Division
73M1866B-IMR/F
42-VFQFN Exposed Pad
Quatech-Division of B&B Electronics
HC9P5504B-5
24-SOIC (0.295", 7.50mm Width)
Laird - Wireless & Thermal Systems
TS190PTR
8-SMD, Gull Wing
FinishAdapt Limited
CYV15G0404RB-BGC
256-BGA Exposed Pad
ebm-papst Inc.
HC3-5504-5X154
FinishAdapt Limited
PEF22624EV1.3-G
324-LBGA
Laird - Wireless & Thermal Systems
CPC7581MB
16-VDFN Exposed Pad
ON SEMICONDUCTOR
TDA18264HB/C1
80-TFQFN Exposed Pad
Z-World
BCM56626B2IFSBLG