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Interface

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Part Number
Manufacturers
Desc
Enquiry
Packing
Details
Advanced Linear Devices Inc.
MC1489AN
14-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX322CSA+
8-SOIC (0.154", 3.90mm Width)
IXYS Integrated Circuits Division
MAX3488EEPA
8-DIP (0.300", 7.62mm)
Imagecraft
Z0220112VSCR3470TR
44-LCC (J-Lead)
Quatech-Division of B&B Electronics
ICL232CPE
16-DIP (0.300", 7.62mm)
MaxLinear, Inc.
SI32172-C-FM1R
42-VFQFN Exposed Pad
Laird - Wireless & Thermal Systems
M-986-2A1PL
44-LCC (J-Lead)
IXYS Integrated Circuits Division
MAX339MSE/PR3+
16-SOIC (0.154", 3.90mm Width)
ON SEMICONDUCTOR
74HC4353D,652
20-SOIC (0.295", 7.50mm Width)
Samtec Inc.
AD8018AR-REEL7
8-SOIC (0.154", 3.90mm Width)
Wandboard.Org
74HCT4053DB,118
16-SSOP (0.209", 5.30mm Width)
MaxLinear, Inc.
SI32171-B-FM1
42-WFQFN Exposed Pad
SolidRun LTD
DS14C232TWMX
16-SOIC (0.295", 7.50mm Width)
MaxLinear, Inc.
SI32392-B-FM1
48-VFQFN Exposed Pad
Tusonix a Subsidiary of CTS Electronic Components
14285R-100
48-VFQFN Exposed Pad
Advanced Linear Devices Inc.
TSB14C01PM
Z-World
BCM53125MKMMLG
-
Advanced Linear Devices Inc.
TDP158RSBR
40-WFQFN Exposed Pad
ON SEMICONDUCTOR
PCA9548APW,118
24-TSSOP (0.173", 4.40mm Width)
Samtec Inc.
ADM202JRW-REEL
16-SOIC (0.295", 7.50mm Width)
MaxLinear, Inc.
SI3011-F-FM
20-VFQFN Exposed Pad
Z-World
BCM53161XMB1KLFBG
-
FinishAdapt Limited
TLE8457DSJXUMA1
8-SOIC (0.154", 3.90mm Width)
Imagecraft
Z0221524AECR50A5
44-LQFP
Laird - Wireless & Thermal Systems
CPC2400E
Module
ON SEMICONDUCTOR
HEF4053BP,652
16-DIP (0.300", 7.62mm)
IXYS Integrated Circuits Division
MAX4752EUD+
14-TSSOP (0.173", 4.40mm Width)
Wandboard.Org
74HCT4053DB,112
16-SSOP (0.209", 5.30mm Width)
Samtec Inc.
ADM4850ARMZ-REEL7
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Bergquist
UM3491EESE
14-SOIC (0.154", 3.90mm Width)