|
Part Number |
|
|
|
|
Details |
|
|
|
FinishAdapt Limited |
PEB22522FV2.1
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
DS2153Q-A5/T&R
|
|
44-LCC (J-Lead) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HIN238CBZ-T
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|
|
|
ON SEMICONDUCTOR |
TDA8024AT/C1
|
|
|
|
|
|
|
BeagleBoard.org |
26LS32/BEA
|
|
|
|
|
|
|
NMB Technologies Corporation |
5962-8757502QA
|
|
40-CDIP |
|
|
|
|
Advanced Linear Devices Inc. |
5962-87809012A
|
|
|
|
|
|
|
Alpha & Omega Semiconductor Inc. |
RAA2S4251B5HWT#AFE
|
|
Die |
|
|
|
|
Samtec Inc. |
LT1039ACN#PBF
|
|
18-DIP (0.300", 7.62mm) |
|
|
|
|
Samtec Inc. |
LT1032CSW#PBF
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Laird - Wireless & Thermal Systems |
TS118S
|
|
8-SMD, Gull Wing |
|
|
|
|
Micross Components |
MCP96L01-E/MX
|
|
20-VQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
DS2154LD1
|
|
100-LQFP |
|
|
|
|
IXYS Integrated Circuits Division |
DS2143QN/T&R
|
|
44-LCC (J-Lead) |
|
|
|
|
Micross Components |
AY-6-1013
|
|
|
|
|
|
|
Transphorm |
PI3HDX511EZLSEX
|
|
32-WFQFN Exposed Pad |
|
|
|
|
SolidRun LTD |
DS38EP100SDX/NOPB
|
|
6-WDFN Exposed Pad |
|
|
|
|
Samtec Inc. |
LTC1690CN8#PBF
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
MCP96L00-E/MX
|
|
20-VQFN Exposed Pad |
|
|
|
|
FinishAdapt Limited |
PEF22810T-V21TR
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HIN241CB
|
|
28-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
ICL3207CAZ
|
|
24-SSOP (0.209", 5.30mm Width) |
|
|
|
|
Advanced Linear Devices Inc. |
TNETA1500APGE
|
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX35101EHJ+T
|
|
32-TQFP Exposed Pad |
|
|
|
|
Alpha & Omega Semiconductor Inc. |
HIN238CPZ
|
|
24-DIP (0.300", 7.62mm) |
|
|
|
|
TDK-EPC |
TDC-GP30YD-F01 3K
|
|
32-VFQFN Exposed Pad |
|
|
|
|
Advanced Linear Devices Inc. |
5962-9087001MKA
|
|
|
|
|
|
|
Quatech-Division of B&B Electronics |
CP82C89
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
DS2151QN/T&R
|
|
44-LCC (J-Lead) |
|
|
|
|
Laird - Wireless & Thermal Systems |
CYG2030
|
|
18-DIP Module (0.850", 21.59mm), 11 Leads |
|
|
|
