|
Part Number |
|
|
|
|
Details |
|
|
|
Omron Electronics Inc-EMC Div |
LM324ADR2
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3747EUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM224N
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3748BETE#G16
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Omron Electronics Inc-EMC Div |
TCA0372DP1
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3268CUB+T
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3269CUB+T
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Micross Components |
SY88983VKG
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM358DR2
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM833DR2
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3265CUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Brady Corporation |
TS27L4AIN
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
Micross Components |
SY88973VEY-TR
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM224DR2
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
|
Micross Components |
SY88973VMG-TR
|
|
16-VFQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3268CUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5168MCCM+
|
|
48-LQFP |
|
|
|
|
Brady Corporation |
TS27L4IN
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3748HETE#G16
|
|
16-WFQFN Exposed Pad |
|
|
|
|
Brady Corporation |
L2724
|
|
9-SIP |
|
|
|
|
Omron Electronics Inc-EMC Div |
TCA0372DWR2
|
|
16-SOIC (0.295", 7.50mm Width) |
|
|
|
|
Omron Electronics Inc-EMC Div |
LM2904DR2
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5168LCCM+
|
|
48-LQFP |
|
|
|
|
IXYS Integrated Circuits Division |
MAX5168NCCM+
|
|
48-LQFP |
|
|
|
|
Brady Corporation |
TS613IDT
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3822UCM+T
|
|
48-TQFP Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3269CUB+
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
|
|
|
|
Brady Corporation |
TSH72CD
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3654ETE+
|
|
16-WQFN Exposed Pad |
|
|
|
|
IXYS Integrated Circuits Division |
MAX3861ETG+T
|
|
24-WFQFN Exposed Pad |
|
|
|
