|
Part Number |
|
|
|
|
Details |
|
|
IXYS Integrated Circuits Division |
MAX9718EEBL+TG45
|
|
9-WFBGA, WLBGA |
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|
|
IXYS Integrated Circuits Division |
MAX9723AEBE+
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9718DETB+
|
|
10-WFDFN Exposed Pad |
|
|
|
Terasic Inc. |
NJM2188D
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX9700AEBC+
|
|
10-WFBGA, CSPBGA |
|
|
|
Nidec Copal Electronics |
TCB001FNG,EL
|
|
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
|
|
|
IXYS Integrated Circuits Division |
MAX98708BENA+G7
|
|
|
|
|
|
Advanced Linear Devices Inc. |
LM3875T
|
|
TO-220-11 (Formed Leads) |
|
|
|
FinishAdapt Limited |
98-1059PBF
|
|
|
|
|
|
Raltron Electronics |
MP7782DF-LF-P
|
|
20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
|
|
|
Terasic Inc. |
NJM2199D
|
|
|
|
|
|
Terasic Inc. |
NJM2179D
|
|
|
|
|
|
IXYS Integrated Circuits Division |
MAX98708BENA+TG7
|
|
|
|
|
|
Terasic Inc. |
NJW1109D
|
|
|
|
|
|
Terasic Inc. |
NJM2135L
|
|
|
|
|
|
Advanced Linear Devices Inc. |
LM1877M-9/NOPB
|
|
14-SOIC (0.295", 7.50mm Width) |
|
|
|
Laird Technologies - Thermal Materials |
IS31AP2145E-UTLS2-TR
|
|
9-UFBGA |
|
|
|
ON SEMICONDUCTOR |
TDA8588AJ/N3,112
|
|
37-SSIP Formed Leads |
|
|
|
ON SEMICONDUCTOR |
TDA8588BJ/N3,112
|
|
37-SSIP Formed Leads |
|
|
|
Advanced Linear Devices Inc. |
TAS5414ATDKDQ1
|
|
36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
|
|
|
Advanced Linear Devices Inc. |
LM1877N-9/NOPB
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
Advanced Linear Devices Inc. |
LMV1088RLX/NOPB
|
|
36-WFBGA, DSBGA |
|
|
|
ON SEMICONDUCTOR |
TDA8588J/N3,112
|
|
37-SSIP Formed Leads |
|
|
|
Advanced Linear Devices Inc. |
LM48821TLX/NOPB
|
|
16-WFBGA, DSBGA |
|
|
|
ON SEMICONDUCTOR |
TDA8589AJ/N3,112
|
|
37-SSIP Formed Leads |
|
|
|
ON SEMICONDUCTOR |
TDA8589BJ/N3,112
|
|
37-SSIP Formed Leads |
|
|
|
ON SEMICONDUCTOR |
TDA8589J/N1,112
|
|
37-SSIP Formed Leads |
|
|
|
ON SEMICONDUCTOR |
TDA8932BT/N2,118
|
|
32-SOIC (0.295", 7.50mm Width) |
|
|
|
Advanced Linear Devices Inc. |
LM4700TF/NOPB
|
|
TO-220-11 Isolated Tab, Formed Leads |
|
|
|
ON SEMICONDUCTOR |
TDA8932BTW/N2,112
|
|
32-TSSOP (0.240", 6.10mm Width) Exposed Pad |
|
|