|
Part Number |
|
|
|
|
Details |
|
|
ebm-papst Inc. |
CA3001/3
|
|
- |
|
|
|
ebm-papst Inc. |
HFA1105IB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
EL5128CY
|
|
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HA4600CPZ
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
ebm-papst Inc. |
HA5024IP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
SolidRun LTD |
CLC412AJE
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
EL2250CS
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Omron Electronics Inc-EMC Div |
STK392-150-E-ON
|
|
|
|
|
|
SolidRun LTD |
CLC5623IM
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
SolidRun LTD |
LMH6714MA
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HA5023IP
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
Laird Thermal Systems, Inc. |
EL9202ILZ
|
|
24-VFQFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
HFA1105IB96
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HFA1109IB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX4314ESD-T
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
SolidRun LTD |
LMH6722MAX
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HA3-5020-5
|
|
8-DIP (0.300", 7.62mm) |
|
|
|
Quatech-Division of B&B Electronics |
HFA1109IBZ
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Gardtec Incorporated |
OPA3355UAG4
|
|
14-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HFA1405IP
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
SolidRun LTD |
CLC5622IM
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HFA1105IB
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
SolidRun LTD |
LMH6734MQ/NOPB
|
|
16-SSOP (0.154", 3.90mm Width) |
|
|
|
Quatech-Division of B&B Electronics |
HA5024IP
|
|
20-DIP (0.300", 7.62mm) |
|
|
|
SolidRun LTD |
CLC5623IN
|
|
14-DIP (0.300", 7.62mm) |
|
|
|
Advanced Linear Devices Inc. |
OPA2832ID
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX467CPE
|
|
16-DIP (0.300", 7.62mm) |
|
|
|
Laird Thermal Systems, Inc. |
EL9201ILZ
|
|
16-VQFN Exposed Pad |
|
|
|
Quatech-Division of B&B Electronics |
HFA1135IB96
|
|
8-SOIC (0.154", 3.90mm Width) |
|
|
|
IXYS Integrated Circuits Division |
MAX463CWG
|
|
24-SOIC (0.295", 7.50mm Width) |
|
|